PCB Fabrication: What SI/PI Engineers Need to Know for First Time Modeling Success

Speaker: Lambert (Bert) Simonovich, President, Lamsim Enterprises

A PCB stackup drawing is the first step in the fabrication process. A poorly designed stackup and lack of detailed fabrication notes can result in degraded signal & power integrity, manufacturability, and reliability of the finished product. Often SI/PI engineers make wrong design assumptions, leading to inaccurate modeling and simulation results. Because of this, they need to understand the PCB design and fabrication nuances to avoid pitfalls in achieving first time modeling success. This webinar will delve into the PCB design best practices that SI/PI engineers need to follow for optimum performance.

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400 Gbps & Beyond Optical Transceiver Design Considerations

Speakers: Sanjeev Gupta, R&D Manager, Intel and Sunil Priyadarshi, Sr. Director, Intel

Hyper-scale data centers (HSDC) typically require millions of optical transceivers, creating a huge demand for 400G/800G products. The exponential growth in data communication driven by HSDC due to cloud computing, cloud storage, Augmented Reality (AR), Virtual Reality (VR), Video on Demand (VoD), 5G, Internet of Things (IoT), and autonomous driving are the dictating factors for much higher bandwidth and lower power consumption. Optical transceiver design is a complex process as it requires multiple disciplines such as electrical, mechanical, optical, and firmware to come together precisely to provide the required electro-optical performance. The designer faced significant challenges in the design of 800-Gbps transceivers due to their form factor, high-speed, high power consumption, and channel density. Now that 800-Gbps transceivers are in their early sampling stage, the optical industry has already started the discussion on the next generation of optical transceivers providing a bandwidth of 1.6 Tbps and 3.2 Tbps. Designing these new generations of transceivers will require a much higher level of integration and many technological and packaging breakthroughs. This webinar will introduce the basics of optical transceivers and discuss the design consideration of 400-Gbps, 800-Gbps, and next-generation transceivers.

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Power Integrity: Analyze Impedance to Improve Power Delivery, SI & EMI

Speakers: Heidi Barnes, SI and PI Applications Engineer, Keysight Technologies and Steve Sandler, Managing Director, Picotest

Power Integrity is all about delivering the appropriate power to maintain the Signal Integrity of dynamic loads. All with power delivery design margins that allow for reliable product performance. The key challenge for the PI engineer is that the dynamic load can operate from DC to GHz resulting in extreme bandwidths of power delivery and the potential for EMI. Target Impedance vs. frequency is a great tool for designing for power delivery over the full bandwidth of the dynamic load, but designers often fail to use its full benefit. This webinar will cover the basics of target impedance, and then go beyond to show the benefits of advanced impedance analysis techniques for power delivery.

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Controlling the Waves: A Field-based Perspective on High-speed PCB Design

Speaker: Daniel Beeker, Senior Principal Engineer, NXP

Good signal integrity and EMC start with a good PCB design philosophy. It is critical for design engineers to understand the behavior of EM fields. Proper design of the spaces these fields follow through the board is critical. Creating transmission lines that will meet the needs of the PDN and the fast switching ICs in today’s high-performance products can be a challenge. There are certain questions that need to be answered to define the PCB geometry that will lead to a successful design. This webinar will present an easy to understand science-based approach for PCB design.

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OEM Roundup 2021: The New ADAS

Speaker: Danny Kim, Director of Advisory Services, VSI Labs

In its OEM Roundup last year, VSI reported that automotive OEMs pushed hard to debut new and improved L2+ ADAS systems utilizing improved software algorithms, additional sensors, and more scalable platforms. A few OEMs seemed to be interested in demonstrating L3 reliability in their new systems, while most others were enhancing features of their L2+ systems. While six levels of driving automation reveal that the biggest gap is between Level 2 and 3, OEMs are pushing to market L2+ and L2++ systems, namely "The New ADAS." This webinar will investigate the latest trends and systems in OEMs’ consumer ADAS as we look further into 2021 in lieu of the industry extending the definition of L2+ to embrace a certain configuration of ADAS systems hosting additional key enabling components.

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Join DesignCon and Design News in this fall 2020 Back-to-School webinar series presented by expert engineers from the electronics chip, board, and system industries. These sessions walk through several use cases, illustrate how to use various tools to solve a range of design problems, present practical workshops, and provide attendees an understanding of why some design looks good on paper but fails once implemented.