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Join DesignCon and Design News in this five-part Back-to-School webinar series presented by expert engineers from the electronics chip, board, and system industries. These sessions will walk through several use cases, illustrate how to use various tools to solve a range of design problems, present practical workshops, and provide attendees an understanding of why some design looks good on paper but fails once implemented. Attendees will also hear updates on DesignCon 2021 and receive a discount code for the upcoming in-person conference.
Beginner's Guide to RF & Microwave PCB Design
Speaker: Ben Jordan, President, JordanDSP.com
Learn the basics of RF board layout and how to visualize the elements available and build and test using desktop prototyping gear. We will cover transmission line structure and elements, evaluation skills, PCB antennas, and Smith charting tools.
Open-Source Software Tools for Signal Integrity
Speaker: Peter Pupalaikis, Vice President, Advanced Technology Development, Teledyne LeCroy
Learn the Python-based open-source software tool called SignalIntegrity, which is ideal for calculating single-ended or mixed-mode s-parameters of interconnected networks, frequency and time-domain de-embedding, and linear simulation of systems.
The Hidden Challenges in 112-Gb Channel Design & Modeling
Speakers: Alex Manukovsky, Technical Lead, SI/PI Team, Intel; Roee Bloch, Senior Staff Hardware Engineering Lead, Marvell Semiconductor; Shai Sayfan Altman, Senior Application Engineer, ANSYS
Learn manufacturing aspects to consider while designing a 112-Gb channel, including an introduction to robust channel design practices and the common pitfalls in the BKM's used today across the industry in design and modeling of high-speed channels.
Current Distribution, Resistance & Inductance in Power Connectors
Speakers: Adam Gregory, Signal Integrity Engineer, Samtec; Clement Luk, Signal Integrity Engineer, Samtec
Learn why layered metal in power connector pins impact low and high frequency inductance and resistance differently, and why current distribution and noise coupling varies with pin assignment and layout of connected boards.
PCB Material Characterization with One Measurement
Speakers: Jason Ellison, Senior Staff Signal Integrity Engineer, Amphenol; Michael Rowlands, Signal Integrity Engineer, Amphenol
Discover the usefulness of an already useful de-embedding technology to extract material properties with just one measurement, saving valuable time when evaluating test vehicles and debugging unusual results.