Join DesignCon and Design News in this five-part Back-to-School webinar series presented by expert engineers from the electronics chip, board, and system industries. These sessions will walk through several use cases, illustrate how to use various tools to solve a range of design problems, present practical workshops, and provide attendees an understanding of why some design looks good on paper but fails once implemented. Attendees will also hear updates on DesignCon 2021 and receive a discount code for the upcoming in-person conference.
Beginner's Guide to RF & Microwave PCB Design
Speaker: Ben Jordan, President, JordanDSP.com
Learn the basics of RF board layout and how to visualize the elements available and build and test using desktop prototyping gear. We will cover transmission line structure and elements, evaluation skills, PCB antennas, and Smith charting tools.
Open-Source Software Tools for Signal Integrity
Speaker: Peter Pupalaikis, Vice President, Advanced Technology Development, Teledyne LeCroy
Learn the Python-based open-source software tool called SignalIntegrity, which is ideal for calculating single-ended or mixed-mode s-parameters of interconnected networks, frequency and time-domain de-embedding, and linear simulation of systems.
The Hidden Challenges in 112-Gb Channel Design & Modeling
Speakers: Alex Manukovsky, Technical Lead, SI/PI Team, Intel; Roee Bloch, Senior Staff Hardware Engineering Lead, Marvell Semiconductor; Shai Sayfan Altman, Senior Application Engineer, ANSYS
Learn manufacturing aspects to consider while designing a 112-Gb channel, including an introduction to robust channel design practices and the common pitfalls in the BKM's used today across the industry in design and modeling of high-speed channels.
Current Distribution, Resistance & Inductance in Power Connectors
Speakers: Adam Gregory, Signal Integrity Engineer, Samtec; Clement Luk, Signal Integrity Engineer, Samtec
Learn why layered metal in power connector pins impact low and high frequency inductance and resistance differently, and why current distribution and noise coupling varies with pin assignment and layout of connected boards.
Sponsored By
PCB Material Characterization with One Measurement
Speakers: Jason Ellison, Senior Staff Signal Integrity Engineer, Amphenol; Michael Rowlands, Signal Integrity Engineer, Amphenol
Discover the usefulness of an already useful de-embedding technology to extract material properties with just one measurement, saving valuable time when evaluating test vehicles and debugging unusual results.
Sponsored By
Browse featured coverage to find quick links to event-based announcements, exhibitor updates, and industry theory. Connect with DesignCon’s Public Relations team at [email protected] or visit the media center to help secure pre-show coverage, assistance with onsite interviews, and to discuss announcement strategy best practices.
February 26, 2020
Storage and memory are key elements in system design. The movement to chiplets and high-performance AI accelerators are driving demand for high bandwidth memory solutions.
February 10, 2020
All serial data streams have some jitter where the timing of bit edges differs from the ideal. With serval types of jitter composing a signal’s total jitter, you need to know which forms of jitter reduce bit-error-ratio. Oscilloscopes can decompose jitter and let you see which forms limit data transmissions.
January 30, 2020
Istvan Novak from Samtec and Engineer of the Year at DesignCon 2020 sat down with Design News to answer technical and show questions from over the last 20 years.
December 9, 2019
For any engineer or technologist focused on high-speed communications, DesignCon is the center of the universe.
March 4, 2020
DesignCon has become one of the leading conferences showcasing the latest high-speed technology for data communications and it attracts the “best of the best” in hardware engineers and vendors in the fields of signal integrity, power integrity, and (to a lesser degree) EMC/EMI.
January 28, 2020
One of the most valuable aspects of DesignCon isn’t the panels, discussions, and presentations that provide continuing education on upcoming advancements in technology, but networking with other engineers who are in attendance.
February 6, 2020
DesignCon celebrated its 25th anniversary and we were happy to be part of it. Follow Judy Warner through the conference and see the highlights in this video.
This report is a study of the status of 5G in the manufacturing sector and provides an overview of this technology from a purely industrial perspective.
June 17, 2020
Automotive IC segment to show robust average annual growth but still hold less than a 10% share in 2024. Communications and Computer segments remain largest applications.
July 28, 2020
Investments in 5G network infrastructure to reach 21.3% of total wireless infrastructure.
July 27, 2020
By 2025 there will be 55.9B connected devices worldwide, 75% of which will be connected to an IoT platform.