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#DesignCon
As the electronic industry surges ahead, so does the need for practical insights and solutions to engineer the next generation of products. Enter DesignCon. With technical paper sessions, panels, tutorials, and boot camps spanning 15 tracks, DesignCon’s three-day conference program provides the information you need to solve design challenges now and plan how to improve designs in the future.
Hosted in Silicon Valley, the heart of electronics innovation, DesignCon addresses chip, board, and system challenges facing design engineers. Sessions are provided for all levels of learning, with information for experienced engineers, recent graduates, and everyone in between.
From foundational to applicational, DesignCon conference areas include:
Explore by area of interest with education themes in automotive, autonomous, consumer electronics, Internet of Things (IoT), and medical that will be addressed in multiple conference and theater sessions and represented at exhibits on the expo floor.
Created by our Technical Program Committee (TPC)—an expert panel of approximately 100 industry professionals — the DesignCon curriculum is reviewed and updated each year to meet the needs of our ever-evolving industry. DesignCon sets the industry standard for education and technology conferences, offering today's mission-critical information for people designing tomorrow's electronics products.
Below is a description of each DesignCon 2026 track, including sample topic and session suggestions for Call for Abstracts submissions.
Click on a track name for more details.
Below is a description of each DesignCon 2026 track, including sample topic and session suggestions for Call for Abstracts submissions.
Click on a track name for more details.
Die, chiplet, optic, interposer, breakout, and packaging decisions can make or break a high-performance interface. This track covers a wide variety of signal and power integrity topics at the die, chiplet, interposer, packaging, and system interface levels. This includes fabrication technology, SoC issues, multi-chip integration, chiplet ecosystems, co-packaged optics, power delivery networks, related noise and jitter mitigation strategies.
CFA topics of interest
Accurate sub-system and component models are crucial for predicting critical aspects of system performance. This track focuses on the creation and validation of essential silicon, substrate, and component-level models that are necessary for system design and verification.
CFA topics of interest
Integrating photonics and wireless technology into electrical designs presents distinct challenges at the chip, board, and system levels. This track focuses on design and integration challenges of photonics and wireless ICs, including 3D packaging that combines optical and electrical interconnects, co-packaged direct drive and retimed optics, for emerging applications in artificial intelligence, machine learning, wireline data ommunication, wireless and mmWave technologies.
CFA topics of interest
Printed circuit board (PCB) materials and fabrication processes can affect the electrical properties and performance of the PCB’s modules and packages. This track considers those needs and analyzes the various solution options.
CFA topics of interest
The recent trends in data center, networking, cloud computing, mobile, autonomous driving, machine learning, virtual/augmented reality, and high-performance computing (HPC) present great challenges in interface design. Interface design also needs to meet increased bandwidth requirements while reducing power, cost, form factor, and maintaining or reducing latency. This track addresses the latest design techniques and signal and power integrity solutions to meet these requirements for various designs in areas of memory interface, such as UCIe, 3DIC/SiP, and high-speed chip-to-chip interconnects. Use of AI/ML techniques to manage the complexity of advanced interface design and optimize trade-offs among power, cost, and latency.
CFA topics of interest
Design-oriented modeling simulation and analysis are required for cost-effective power and signal integrity (SI) performance optimization of chip, package, board, and chip+package+board+VRM combinations. This track covers the broad range of topics required to best address those needs for modern CPU/GPU and digital systems.
CFA topics of interest
System designers must resolve a complex set of tradeoffs among package/board/backplane/cable design, choice of connector/materials, SerDes transmit/receive equalization capabilities, and signal coding schemes to get the high-speed serial channels in their system to meet both performance and cost requirements. This track presents system analysis techniques, design studies, and technology/performance data to help system designers make design and technology choices that are as effective as possible.
CFA topics of interest
High-speed serial system impairments caused by jitter, noise, distortion, crosstalk, and ISI, can translate into bit, symbol, and frame errors. This track covers techniques for reducing errors, BER/SER/FLR (bit/symbol/frame loss ratio) through analysis of measurements, simulations, and models of components, subsystems, and systems.
CFA topics of interest:
High-speed communication systems require increasingly complex signal-processing techniques, including equalization, modulation, synchronization, timing, detection, and FEC methods. This track covers design, modeling, analysis, implementation, and validation of such techniques.
CFA topics of interest
Panel and tutorial topics of interest
Power Integrity (PI), distribution, and management are essential for system functionality and performance. This track addresses system-level power distribution network design, modeling, and analysis on boards, packages, and chips, including thermal and reliability considerations ? - in HPC, AI, and ML applications, for instance. It emphasizes the modeling and analysis of impedance, supply noise, and/or power induced jitter, and their impact on overall system performance.
CFA topics of interest
The electromagnetic compatibility (EMC) and interference (EMI) track aims to cover topics related to the electrical modeling, simulation, design, and validation for product compliance and certification due to EMC/EMI issues. This track raises awareness and the impact for design and systems engineers involved in circuit architecture, supply designs, harnesses, headers, cables, and PCB interface performance in automotive design platforms. It includes power distribution network design effects, modeling and analysis of boards, packages, and chips in order to mitigate possible EMC failures and improve products in the early design stages.
CFA topics of interest
Tutorial topic of interest
Advancements in measurement techniques are constantly being made for all aspects of signal and power integrity. This track focuses on the new techniques with an emphasis on understanding the practical limitations and quality of the measurement as well as the accuracies involved when trying to match simulations with measurements.
CFA topics of interest
Panel topic of interest:
Modeling of signals on interconnects with high data rates often requires use or extension of electromagnetic (EM) analysis techniques. This track includes passive link analysis and optimization for industry standards (28G, 100G, 400G, 800G, PCIE, USB, SATA, DDR, UCIe) with the use of electromagnetic and microwave signal integrity analysis techniques as well as validation with measurements.
CFA topics of interest
Machine-learning algorithms can efficiently derive models for electronics and system design automation and enable fast, accurate design and verification of microelectronic circuits and systems. Unlike traditional programming approaches that have knowledge embedded in complex algorithms and mathematical models, machine learning uses simple algorithms and models, but with numerous parameters, that are intensively trained with complex data sets. Machine learned generative models cover the entire solution space vs. tradition-discriminative models. This track explores applications where machine-learning approaches provide alternative solutions to traditional methods and offer new solutions to challenging problems. Primary foci will be behavioral models, optimization for electronics design, and system analytics with machine learning techniques.
CFA topics of interest
As the design worlds of autonomous vehicle design and electric vehicle design begin to merge, cars are getting smarter and more efficient. This track covers electric vehicle technology and autonomous electronics and intelligence on topics such as accelerating next-gen vehicle design, advanced sensing technology for safety and autonomy, high-speed automotive PCB digital interconnects, SI for automotive multigigabit applications, test and measurement for automotive standards, and EMC/EMI in automotive applications.
CFA topics of interest
Panel and/or tutorial topics of interest: