40 Under 40
#DesignCon
DesignCon 2026 40 Under 40
DesignCon’s 40 Under 40 program launched in 2024 and provides an opportunity for up-and-coming engineers to further their careers through access to all DesignCon education, including its 15-track conference, as well as access to the expo floor and all networking sessions, including an exclusive networking breakfast for the 40 Under 40 and highly regarded industry mentors and DesignCon speakers. Named through an open nomination and review process, DesignCon celebrates the below next-generation leaders and innovators with its 2026 40 Under 40 program. Find them at the show with an identifying “40 Under 40” badge ribbon.
2026 Winners of 40 Under 40
DesignCon congratulates the 2026 winners of the 40 Under 40 program. These emerging engineers and leaders are the recipients of DesignCon’s full conference education to help further their careers:
- Pramod Agastya, Student, Colorado Boulder
- Mohammed Farhan Ahmed, Staff Signal Integrity Engineer, Micron Technology
- Venkata Akunuru, Support Application Engineer, Siemens EDA
- Ashwin K. Avula, Graduate Research Student, University of Wisconsin Madisonz
- Abhishek Bhat, Technical leader ASIC Engineering, Cisco Systems.
- Cameron Bolton, Hardware Design Engineer, Sealevel Systems Inc
- Anthony Bruno, Applications Engineer, Tektronix
- Raheeq Darweesh, Signal Integrity Engineer, Amphenol
- Andre Dekker, PCB Integrity Architect and SI/PI Educator, Sintecs
- Michael Derrenbacher, Validation Engineer, Apple Inc
DesignCon 2025 40 Under 40 Participants
- Sukanta Dey, Senior EDA Software Engineer, Intel Corporation
- Hansel Desmond D'Silva, Standards Development Engineer, Amphenol Corporation
- Farshad Ebrahimi, Ra, University of Houston
- Priya Guruswamy, MTS Silicon Design Engineer, Advanced Micro Devices
- Tyler Huddleston, Signal Integrity and Power Integrity Engineer, Signal Edge Solutions
- Vivek Kamble, Senior Signal and Power Integrity Engineer, NVIDIA corporation
- Erik Keifer, Sales Engineer Intern, Ecolab
- Haeyeon Rachel Kim, Engineer, SK Hynix
- Supreeth L Y, Systems SI Engineer, Apple Inc
- Ryan Lott, Principal Electrical Engineer, Raytheon
- Casey McCrea, Senior Director – Product Applications, Astera Labs
- Tahoura Mosavirik, Signal Integrity Engineer, Amphenol
- Cameron Muldowney, Electronics Engineer, Disher
- Vinod Narayan, Hardware and Systems Architect, Lucid Motors
- Stephen Newberry, SI/PI Engineer, Chipletz Inc
- Dongryul Park, Post-doctoral Fellow, Korea Advanced Institute of Science and Technology (KAIST)
- Neha Pazare, Sr. Signal Integrity Engineer, Amazon Annapurna Labs
- Adinath Phene, Senior Engineer, Marvell
- Norazizah binti Abdul Rahman, Lead Technical Training Engineer
- Seunghun Ryu, Ph.D Candidate, Korea Advanced Institute of Science and Technology (KAIST)
- Sonam Sadhukhan, Senior Staff Engineer, Marvell Technology
- Ramnath Donthi SanathKumar, Hardware Engineer, Apple
- Subramaniam Saravana Sankar, PhD Researcher within EU MSCA PARASOL Project, CEBIA Tech Tomas Bata University CZ
- Nikul Naimesh Shah, Founder & CEO, Indiesemic Pvt Ltd
- Jinal Shah, Co-founder & CMO, Indiesemic Pvt Ltd
- Shaaruk Sharmila, Advanced Packaging Engineer, Marvell
- Dayong Shen, HPN Hardware & High Speed System Techincal Staff, Bytedance
- Vikas Singh, Technical Specialist ADAS HW, Lucid Motors
- Kalyan Vaddagiri, Senior Signal Integrity Engineer, Cisco Systems
- Abhijit Singh Wander, Senior Signal Integrity Engineer, Amphenol
- Gajaba Wickramarathne, Field Sales Engineer, RF Associates North Inc RFAN
- Scott Witcher, SI/PI Technical Staff, Chipletz
- John Yan, Principal Signal & Power Integrity Engineer, Broadcom
- Sijian Yuan, Developer, Ericsson
- Albert Zeien, Graduate Student / Teaching Assistant, Oregon State University
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