April 5-7, 2022|Santa Clara Convention Center| Santa Clara, CA

Nominations for the DesignCon 2022 Engineer of the Year end February 15.

DesignCon's "Engineer of the Year" Award is given out each year during the DesignCon event. The award seeks to recognize the best of the best in engineering and new product advancements at the chip, board, or system level.

The award winner will be selected based on his or her leadership, creativity, and out-of-the-box thinking brought to design/test of chips, boards, or systems, with particular attention paid to areas of signal and power integrity.

Nominations for the DesignCon 2022 Engineer of the Year are open until February 15, 2022, 11:59 PM PST. Members of the DesignCon management team will choose finalists from the nominees, and then the DesignCon and Design News communities will have the opportunity to vote for the engineer who will receive the 2022 Award.

Nominees must be active members of the DesignCon community to be considered for this award.

The winner will be announced at DesignCon 2022 and provided with a $1,000 grant or scholarship to present to the educational institution of his or her choice.

» Nominate someone exceptional to be the DesignCon 2022 Engineer of the Year.

» Official Rules for the DesignCon Engineer of the Year Award.

Questions? Please contact [email protected].

Past Engineer of the Year Award Recipients

We have been pleased to honor these Engineer of the Year Award recipients

Dr. Cathy Ye Liu, distinguished engineer and director, currently heads up Broadcom SerDes architecture and modeling group. Previously she worked as R&D director and distinguished engineer in Avago/LSI which acquired Broadcom. Since 2002, she has been working on high-speed transceiver solutions. Prior to this, she developed read channel and mobile digital TV receiver solutions. Her technical interests are signal processing, FEC, and modeling in high-speed optical and electrical transceiver solutions. She has published many journal and conference papers and holds 20+ US patents.

Cathy is an active member of the DesignCon Technical Program Committee and has been a long-time co-chair for Track 09 “Measurement, Simulation & Optimization of Jitter, Noise & Timing to Minimize Errors.” Cathy has also been a member on the DesignCon Panel; "Case of the Closing Eye" for over 9 years in a row. She is very connected to the DesignCon community as an active presenter on many topics related to chip design.

For the grant, Cathy has chosen the recipient to be the Electrical and Computer Engineering department at University of California, Davis, in order “to help young engineering students to grow.“

2020: Istvan Novak

Istvan Novak has single handedly helped the test and measurement industry develop completely new instruments and methods of measurement. A Life Fellow of the IEEE with 25 patents to his name, he has authored two books on power integrity, teaches signal and power integrity courses, and maintains a popular SI/PI website. He contributes to educating and helping engineers across the world with their SI/PI problems and actively mentors new engineers in his company. Istvan offers congratulations to all the finalists, saying that any one of them could have easily won the title.

Learn more about Istvan in an interview on DesignNews.com.

2019: Vishram Pandit

Vishram Pandit's goal is simple: Share knowledge with the technical community that will one day create the CPUs for next-generation cars, phones, and servers. He is well on his way to making that happen; to date he has co-authored a book on Power Integrity for I/O Interfaces, and is co-author of approximately 30 conference and journal publications, out of which 19 were presented at DesignCon. Those papers have received 3 best paper awards and 3 finalist awards. Vishram received the 2018 Albert Nelson Marquis Lifetime Achievement Award for his contributions to the Signal and Power integrity field.

Learn more about Vishram in his interview with Design News.

2018: Dr. Mike Peng Li

After delivering 19 years’ worth of tutorials and technical papers at DesignCon, Mike Peng Li, Intel Corp. Fellow, says the conference has become part of him. Mike has published approximately 110 technical papers, has earned 30 patents, has been named an IEEE Fellow, and has guided thousands of engineers, scientists, and students with his books and tutorials, especially in the area of jitter.

Read an interview with Dr. Li to learn more about his exceptional career.

2017: Heidi Barnes

Heidi Barnes is well known for her ability to solve problems in the signal integrity (SI) and power integrity (PI) field for Fortune 500 companies. She was selected for the award, in part, because of her dedication to problem solving and enthusiasm for leading and collaborating with teams.

Read more about Heidi in an interview following the reception of her award.

2016: Dr. Eric Bogatin

Eric was invited to present at the first DesignCon back in 1991 and has been doing so ever since. He says that the two essential ingredients to effective teaching are understanding what is confusing to the student, and encouraging participation and engagement. To foster the latter, Eric is known, to everyone’s entertainment, for throwing chocolates out to students when they participate.