January 31 – February 2, 2023 | Santa Clara Convention Center | Santa Clara, CA

Amphenol is proud to be the host sponsor of DesignCon 2022. Their technical experts and application engineers will headline the following sessions at this year’s in-person event. Visit Amphenol in booth 833 on the expo floor.

New System-level Opportunities with OSFP-XD

Date: Wednesday, April 6
Time: 2:15 – 3 p.m.
Location: Chiphead Theater in the expo hall

Join engineering experts to explore OSFP-XD and the new system-level opportunities that are possible with the OSFP-XD form factor. They’ll discuss the technical challenges with the OSFP-XD form factor and what makes OSFP-XD attractive to implementors both inside and outside of the current OSFP user base.

Key takeaways:

  • How the market expectations and needs have changed
  • What are the technical challenges with the OSFP-XD form factor
  • When OSFP-XD will be available in the market

Brian Kirk, Chief Technology Officer

Brian Kirk is Chief Technology Officer of the Amphenol High Speed Group. Brian joined Amphenol in 2004 as an Electrical Engineer in the Signal Integrity group. Brian’s involvement is layered throughout the countless technological advancements within High-Speed Group, including 100G HSIO connectors, cables, and active optical products. Brian earned a PhD in Electrical Engineering from the University of New Hampshire, and a bachelor’s degree from the University of Vermont.

Sam Kocsis, Director of Standards and Technology

Sam Kocsis currently holds the role of Director of Standards and Technology at Amphenol, focusing on the proliferation of innovative interconnect solutions. Sam coordinates Amphenol’s involvement in various industry standards and consortiums across networking, server/storage, optics, and commercial markets. He is active in IEEE 802.3 and OIF projects, leads several ad-hoc activities for the OSFP MSA and currently chairs the PCI SIG Cabling Workgroup. Sam holds BSEE and MSEE degrees from the University of Rochester, in Rochester, New York.

Overpass – The Roadmap to 56G, 112G and 224G IO Interconnect Solutions

Date: Wednesday, April 6
Time: 1:15 – 2 p.m.
Location: Mission City Ballroom B4

This session will introduce HSIO OverPass® technology and solutions – what it is, its advantages, and why it is necessary as systems march towards higher electrical signaling speeds. The discussion will include an introduction to current and future product offerings and deployment scenarios.

Key Takeaways:

  • Significant loss budget and system cost advantages associated with OverPass® technology
  • Superior SI performance and bandwidth density of near chip interfaces – DensiLink® and MicroLinkOVER™
  • Technology that is well suited now and necessary in the future

Vishal Chandrasekar
OverPass® Product Line Manager

Automotive High-Speed Signal Protocols & Standards

Date: Wednesday, April 6
Time: 2:35 – 3:05 p.m.
Location: Mission City Ballroom B4

The presentation will cover Automotive High-Speed Signal Protocols & Standards. The focus will be to briefly discuss the trends in Automotive and the high-speed protocols and standards that are going to be the important ones to follow and the types of applications they are used for.

Key takeaway from this presentation will be to get a high-level understanding of where things are at in Automotive in terms of standards work and the applications they serve.

Harsh Patel, Senior Field Application Engineer

Harsh Patel, a Senior Field Application Engineer is focused on the Automotive Markets for Amphenol CS division. Prior to Amphenol, Harsh has worked at Molex as Signal Integrity Engineering supervisor for their Connected Mobility Solutions group. He has been active in the IEEE automotive standards such as 802.3ch (2.5G/5G/10G) and 802.3cy (25G+) as well as the Open Alliance TC9 working group and writing team. Harsh holds a bachelor’s degree in Electrical Engineering from McMaster University and currently pursuing an Executive MBA at Quantic School of Business and Technology.

An Interview With Tom Pitten, Chief Technology Officer for Amphenol ICC

Advancing High-Speed Communications with Industry-Leading Supplier, Amphenol, at DesignCon 2022
By Suzanne Deffree, Group Event Director, DesignCon

As personal connectivity and IoT continue to expand, the broadband and telecom sectors are amid a significant surge in data consumption. As such, the cables and connectors market is experiencing high growth and market disruption, largely due to ballooning consumer demand for ultra-speedy 5G tech, increasing expenditure in enterprise cloud-based applications, and the rising pressure to improve bandwidth.

An industry poised to reach $161.9 billion by 2025, the cables and connectors sectors, like the high-tech interconnect, sensor, and antenna markets, are in critical need of peer-to-peer connection and education to overcome the challenges associated with such remarkable market performance and continue to innovate.

World-renowned supplier Amphenol, for example, is bolstering the refinement and delivery of new-age technology for end-to-end communications networks in today's connected world. As one of the industry's fastest growing organizations fueling innovation and meeting the demand for electronic systems performance, Amphenol is the host sponsor of DesignCon, the nation's largest event for chip, board, and systems design engineers.

The three-day conference and exhibition, to be held April 5-7 at the Santa Clara Convention Center, serves as the meeting place for the premier high-speed communications and system design conference, offering industry-critical engineering education in the heart of electronics innovation — Silicon Valley. Extending its opportunities beyond its 3-day in-person event, DesignCon this year will complement its event with an online component, where attendees can access select education and exhibitor resources pre- and post-event.

With DesignCon on the near horizon, DesignCon Group Event Director Suzanne Deffree spoke with Tom Pitten, Chief Technology Officer for Amphenol ICC. We discussed market trends, the upcoming event, and what attendees can look forward to learning about at the Amphenol booth.

Suzanne: What are the key industry growth drivers that will shape the industry's future, and how is Amphenol influencing these trends?

Tom: The most significant industry change over the last decade is the rise of the hyper-scale data center. These massive cloud computing centers now consume a substantial percentage of all electronic systems, and the hardware teams designing them have an insatiable appetite for performance and density. The vast array of leading-edge interconnect products Amphenol provides is helping to enable the rapid improvement in data center performance.

Suzanne: With the rapid advancement of technology, machinery and systems are becoming increasingly complex. How does Amphenol help its partners overcome this challenge while maintaining high performance and reliability?

Tom: The pace of development for higher performance, next-generation systems has clearly accelerated. The products that enable that performance are becoming exceedingly more complex and require innovative solutions in design and materials. To keep up with the pace, we're increasing our investment in enabling interconnect technologies years in advance from when they will be required. We're also dedicating more engineering resources to help lead industry standards by working closely with customers and collaborators.

Suzanne: We're so excited to have your support as DesignCon's host sponsor and a prominent exhibitor for this year's event. What excites you about reconnecting with your community in person this April?

Tom: We've been a participant at DesignCon since the early days in the mid-1990s. We've been thrilled to witness its incredible growth from a fledgling conference meant to advance industry knowledge of an emerging challenge called "Signal Integrity" to the premier conference on Electronic System Design. We're honored to be the host sponsor, and we're looking forward to the opportunity to connect in person with our customers and the entire electronics design community.

Suzanne: What role do you see DesignCon plays in advancing the system design engineering industry?

Tom: DesignCon has helped educate and continuously improve the engineering capability of the electronics industry. It continues to be an important avenue to share ideas and collaborate on new design challenges. We are looking forward to connecting with the industry and sharing new interconnect solutions from Amphenol.