Industry Tracks

Chip-Level Design for Signal/Power Integrity
Signal and power integrity challenges exist at all levels of electronic design. The papers of this track explore the special challenges and solutions driven by the feature sizes and geometries encountered at the chip level.

Analog and Mixed-Signal Design and Verification
As tools for automating electronic design have evolved, the “hard” problems of analog design and mixtures of analog and digital signals have often been set aside in favor of more tractable problems in pure digital design. The papers of this track provide examples of progress in meeting the challenges of an analog world.

FPGA Design and Debug
Field programmable gate array (FPGA) devices have become key components in a growing number of electronic designs. The increasing power of these devices has made them viable alternatives to application-specific integrated circuits, making them especially attractive for low-volume applications. This track includes sessions on a variety of FPGA applications along with FPGA design and debug tools.

System Co-Design: Chip/Package/Board
Conceptually, following a signal as it travels from one chip to another across boards and backplanes is straightforward. Crossing the boundary between chip and board requires special attention to the effects of the package and interconnects, as evidenced by the papers in this track.

PCB Materials, Processing and Characterization
The printed circuit board has evolved from a convenient way to mount and interconnect electronic components to a sophisticated subsystem in its own right. PCB designers must consider not only the characteristics of the board and the wiring embedded in it, but also how it interacts with the devices mounted on it.

PCB Design Tools and Methodologies
This is a companion track to the one on PCB Materials, Processing and Characterization, presenting tools and techniques that allow board-level designers to push the limits of modern PCB materials and processes.

Memory and Parallel Interface Design
Getting bits of information in and out of memory seems simple enough in concept. Doing it as fast as possible with high accuracy drives ever-increasing levels of sophistication in interface design and standards.

High-Speed Serial Design
Sending information from one place to another quickly and accurately within the physical constraints imposed by available technology presents a classic engineering challenge. This track presents the state of current practice when the constraints are the characteristics of a single interconnect.

High-Speed Timing, Jitter and Noise Analysis
Life would be so much easier if signals behaved and left each other alone. They don’t, however, which make the papers of this track required reading for anyone concerned with high-speed signaling.

High-Speed Signal Processing, Equalization and Coding
Are your signals misbehaving? Are they being bullied by noise and other, stronger signals? The papers of this track will help restore your signals to a clean, wholesome, and happy state.

Power Integrity and Power Distribution Network Design
Power planes and power distribution networks provide the foundation on which signals are built. These papers present the insights and techniques for creating a solid foundation to underpin the rest of the design.

Electromagnetic Compatibility and Interference
Electronic designers must not only protect against electromagnetic radiation as a source of interference, but also minimize the amount generated in their designs to ensure compatibility with standards. The papers in this track address both aspects in assessing and compensating for these effects.

Test and Measurement Methodology
High-performance electronic design requires high-quality test and measurement capabilities to qualify components and validate designs. This track covers a broad range of tools and techniques in this essential area.

RF/Microwave Techniques for Signal Integrity
As signaling rates increase into the multi-gigabit-per-second range, signal integrity engineers confront phenomena at correspondingly higher frequencies. These papers draw on the knowledge base of RF and microwave engineers to extend the range of the signal integrity toolkit.

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