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DesignCon 2014 Technical Program Committee

We would like to thank the volunteers who served on the Technical Program Committee for DesignCon 2014. Their contributions as reviewers of the abstracts and papers have made it possible for us to maintain the DesignCon standard of excellence and deliver an outstanding program again this year.

A - E

Brice Achkir, Cisco Distinguished Engineer, Cisco Systems
Maria Agoston, Principal Engineer, Tektronix, Inc.
Ravinder Ajmani, Senior Engineer, Hitachi Global Storage Technologies
Peerouz Amleshi, Electrical Engineer Manager, Molex
Uday Ammu, Power Engineer, Google
John Andresakis, Vice President of Technology, Oak-Mitsui Technologies
Bruce Archambeault, Distinguished Engineer, IBM
Pervez Aziz, Distinguished Engineer, LSI
Amolak Badesha, Senior R&D Manager, Avago Technologies
Rula Bakleh, SI/PI Specialist, Woodward McCoach, Inc.
Heidi Barnes, Senior Engineer, Agilent Technologies
Andrew Becker, Senior Signal Integrity Engineer, Cray Inc.
Dana Bergey, Signal Integrity Manager, FCI
Wendem Beyene, Senior Principal Engineer, Rambus
Alpesh Bhobe, Technical Leader/HW Manager, Cisco Systems
Eric Bracken, R&D Fellow, ANSYS Inc.
Brad Brim, Product Engineer, Cadence Design Systems
Michael Brownell, Senior Package and Socket Pathfinding Engineer, Intel Corporation
Dave Brunker, Technical Fellow, Molex
Jeremy Buan, Hirose Electric USA
Robert Carter, Sr Manager of Business Development, Oak-Mitsui Technologies
Federico Centola, EMC Technologist, Apple
Jinhua Chen, Director, Product Development, Tyco Electronics
Xiaohe Chen, Signal Integrity Engineer, Apple
Wheling Cheng, Senior Staff Engineer, Juniper Systems, Inc.
Sam Chitwood, Product Engineer, Cadence Design Systems
Daniel Chow, Principle Signal Integrity Engineer, Altera
Daehyun Chung, Sr. Signal Integrity Engineer, nVidia
Antonio Ciccomancini Scogna, Principal Engineer, CST of America
Tom Cohen, Principal Development Engineer, Amphenol-TCS
Sam Connor, Senior Technical Staff Member, IBM
Rick Daniel, Application Engineer, Rohde & Schwarz
Jonathan David, Analog/Mixed Signal/RF Design Verification Senior Staff Engineer, Qualcomm
Daniel de Araujo, Director of Applications, Nimbic
Jan deGeest, Sr. Signal Integrity R&D Engineer, FCI
Don DeGroot, President & Lead Consultant, CCNI, Inc.
Jim DeLap, Technical Manager - HF East, ANSYS, Inc.
Jay Diepenbrock, Senior Technical Staff Member, Lorom Group
Vladimir Dmitriev-Zdorov, Principal Engineer, Mentor Graphics
David Dunham, SI Director, Molex INC.
John Dunn, AWR/NI
Greg Edlund, Senior Engineer, IBM
Anders Ekholm, Expert, Signal Integrity and Timing Analysis, Ericsson AB
 

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F - J

John Ellis, Principal Engineer, Synopsys
Jun Fan, Assistant Professor, Missouri University of Science & Technology
Emerson Fang, Senior Fellow, Advanced Micro Devices
Shayan Farahvash, Senior Principal MTS, Maxim Integrated
Saverio Fazzari, Associate, Booz Allen Hamilton
Edward Frlan, Product Definition Specialist, Gennum Corporation
John Grebenkemper, Consultant, TALI Consulting
Xiaoxiong Gu, Research Staff Member, IBM T. J. Watson Research Center
Sanjeev Gupta, Signal Integrity Applications Expert, Avago Technologies
Hoss Hakimi, Principal Engineer, Xilinx
Robert Haller, Hardware Architect, Enterasys Networks
Gert Havermann, Signal Integrity Engineer, HARTING Electronics GmbH&Co.KG
Adam Healey, Distinguished Engineer, LSI Corporation
Michael Higgins, Principal Engineer, Cray
Kevin Hinckley, Principal Hardware Engineer, Oracle Corp
Tim Hollis, Senior Staff Engineer, Qualcomm, Inc.
Al Horn, Associate Research Fellow, Rogers Corporation
Shamree Howard, Agilent Technologies
Vincent Huang, Signal Integrity Engineer, TE Connectivity
Sachin Idgunji, Principal Engineer, Nvidia
Alfonso Iniguez, Design Verification Lead, Microchip Technology
Takao Inoue, Senior RF Platform Engineer, National Instruments
Cosmin Iorga, Sr. Staff Design Engineer, Inphi Corporation
Charles Jackson, Senior Manager, EMC Team, Nvidia
Mike Jenkins, Senior Staff Design Engineer, Xilinx
 

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K - O

Kumar Keshavan, Sr. Architect, Cadence Design Systems
Joong-Ho Kim, Principal Engineer/Technical Director, Xilinx
Namhoon Kim, Senior Principal Signal Integrity Engineer, Broadcom Corporation
Woopoung Kim, Engineer, Senior Staff, Qualcomm, Inc
Vikas Kohli, Architect, Cadence Design Systems
Ravi Kollipara, Senior Principal Engineer, Rambus
Billy Koo, Principal Engineer, Samsung Electronics
James Kruchowski, Senior Scientist, Mayo Clinic
Taranjit Kukal, Product Engineer, Cadence Design Systems
An-Yu Kuo, Sr. Architect, Cadence Design Systems
Young Kwark, Research Staff Member, IBM T. J. Watson Research Center
Greg Le Cheminant, Measurement Applications Engineer, Agilent Technologies
Beomtaek Lee, Principal Engineer, Intel Corporation
Sangmin Lee, Principal Engineer, Samsung Electronics
Joy Li, Product Engineer, Cadence Design Systems
Mike Peng Li, Principal Architect, Altera Corporation
Zhe Li, Engineer, Altera
Feng Ling, CEO, Xpeedic Technology, Inc.
Cathy Liu, Distinguished Engineer, LSI
Chris Loberg, Senior Manager, Tektronix, Inc.
Brian MacCleery, Principal Product Manager, National Instruments
Om Mandhana, Senior Technical Education Consultant, Cadence Design Systems
Henri Maramis, Technology Architecture Manager, Intel
Mark Marlett, Director of Engineering, Analog Bits
Jon Martens, fellow, Anritsu
Mehdi Mechaik, Senior Signal Integrity Engineer, Nvidia
Ted Mido, Senior Staff R&D Engineer, Synopsys Inc
Jason Miller, Senior Staff Engineer, Oracle
Martin Miller, Chief Scientist, LeCroy Corporation
Mohammad Mobin, Distinguished Engineer, LSI Corporation
Heather Monigan, Sr Analog Engineer, Intel
Jose Moreira, Senior R&D Engineer, Advantest
Chad Morgan, Senior Principal Engineer, TE Connectivity
Zhen Mu, Product Marketing Manager, Mentor Graphics
Muris Mujagic, R&D, Simulation and Modeling, National Instruments
Jim Nadolny, Senior SI and EMI Specialist, Samtec, Inc.
Alfred Neves, Chief Technologist, Wild River Technology LLC
George Noh, Sales and Marketing Director, Holt Integrated Circuits
Alexander Nosovitski, Principal Hardware Engineer, Oracle Corp
Istvan Novak, Distinguished Engineer, Oracle
Gourgen Oganessyan, Staff Product Marketing Engineer, Intersil Corp.
Dan Oh, Signal and Power Integrity Architect, Altera Corporation
Ron Olisar, Principal Member of Technical Staff, Maxim Integrated Products
Glenn Oliver, Research & Development Engineer, DuPont Electronic Technologies
Neilus O'Sullivan, Manager Power Group, Google
 

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P - T

Vishram Pandit, Power Integrity Engineer, Intel
Priya Pathmanathan, Senior Analog Engineer, Intel Corporation
John Plasterer, Manager, Mixed Signal Development, PMC-Sierra
Peter Pupalaikis, VP & Principal Technologist, LeCroy Corporation
Hassan Rafat, Principal Member of Technical Staff, IC Modeling, Maxim Integrated
Vira Ragavassamy, Principal Engineer, Intel Corporation
Shafiq Rahman, Technical Staff Member, Hewlett-Packard
Ajay Rao, Member of Technical Staff, Advanced Micro Devices
Fangyi Rao, R&D Engineer, Agilent Technologies
Mike Resso, Signal Integrity Specialist, Agilent Technologies
Lee Ritchey, President, Speeding Edge
Gerardo Romo, Senior RF/SI Engineer, Qualcomm Inc.
Woong Hwan Ryu, Manager, Signal/Power Integrity, Samsung
Mike Sapozhnikov, Technical Leader, Cisco Systems Inc.
Martin Schauer, Principal Application Engineer, CST of America
Ralf Schmitt, Senior Engineering Manager, Rambus Inc.
Mike Schnecker, Business Development Manager, Rohde & Schwarz
Chris Scholz, Ph.D, Product Manager, Rohde & Schwarz
Christian Schuster, Professor, Technical University Hamburg-Harburg
Megha Shanbhag, Signal Integrity Engineer, TE Connectivity
Bharat Shenoy, Director of Technical Marketing, Littelfuse
Yuriy Shlepnev, President, Simberian, Inc.
Charlie Shu, Senior EMC Manager of Schenzhen Nvidia Team, Nvidia
Chad Smutzer, Senior Engineer, Mayo Clinic
Michael Steinberger, Lead Architect, SiSoft
Ransom Stephens, Applied Electrodynamics Scientist, Ransom's Notes
Sam Stephens, Member of Technical Staff, AMD
Suresh Subramaniam, Sr. Staff Engineer, Tabula, Inc.
Sunil Sudhakaran, Hardware Engineering Manager, nVidia
Shishuang Sun, Senior Member of Technical Staff, Altera
Nicke Svee, Hardware Designer, Ericsson AB
Toshiyuki Takada, Manager, Signal Integrity, Hirose Electric USA
Yuming Tao, Senior engineer, PMC-Sierra
Donald Telian, SI Consultant, SiGuys
Helene Thibieroz, Staff Technical Marketing Manager, Synopsys
Lars Thon, Consultant, LT Engineering
Benjamin Ting, Xilinx
Peter Tomaszewski, Principal Hardware Engineer
 

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U - Z

Arun Vaidyanath, Senior Engineering Manager, Rambus Inc.
Ambrish Varma, Member of Consulting Staff, Cadence Design Systems
Harald von Sosen, Principal Engineer, Synopsys
Min Wang, Engineering Manager, Intel
Sharon Wang, Principal Member of Technical Staff, Maxim Integrated Products
Scott Wedge, Sr. Staff Engineer, Synopsys, Inc.
Kathy Werner, IP Strategy and Business Manager, Freescale Semiconductor
Todd Westerhoff, Vice President, SiSoft
Ken Willis, Product Engineering Director, Cadence Design Systems
Markus Witte, Director, Harting Electronics Gmbh & Co. Kg
Randy Wolff, Signal Integrity Modeling Manager, Micron Technology, Inc
Henry Wong, Principal Engineer, Gennum
Hsinho Wu, Principal Design Engineer, Altera Corporation
Chris Wyland, Manager, Xilinx
Douglas Yanagawa, Technical Lead, Cisco Systems
Yao Chao Yang, Sr. Hardware Manager, Cisco Systems
Mobashar Yazdani, Strategic Silicon Manager, Google, Inc.
Xiaoning Ye, Senior Analog Engineer, Intel
Arch Zaliznyak, Manager, Design Engineering, Altera
Iliya Zamek
Henry Zeng, Senior SI/PI/EMC Engineer, Nvidia
Geoffrey Zhang, CTO (Interconnect), Huawei Technologies
Jianmin Zhang, SI/PI Principal Engineer, Apple
Pavel Zivny, Product Engineer, Tektronix, Inc.