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DesignCon 2013 Technical Program Committee
We would like to thank the volunteers who served on the Technical Program Committee for DesignCon 2013. Their contributions as reviewers of the abstracts and papers have made it possible for us to maintain the DesignCon standard of excellence and deliver an outstanding program again this year.
A - E
Brice Achkir, Cisco Distinguished Engineer, Cisco Systems
Maria Agoston, Principal Engineer, Tektronix, Inc.
Ravinder Ajmani, Principal Hardware Engineer, HGST
Mohammad Ali, Principal Scientist, Broadcom
Peerouz Amleshi, Electrical Engineer Manager, Molex
John Andresakis, Vice President of Technology, Oak-Mitsui Technologies
Bruce Archambeault, Distinguished Engineer, IBM
Pervez Aziz, Distinguished Engineer, LSI
Amolak Badesha, Senior R&D Manager, Avago Technologies
Brian Bailey, Consultant, Brian Bailey Consulting
Rula Bakleh, SI/PS Consultant, RBI
Ted Ballou, Senior Analog Engineer, Intel Corporation
Heidi Barnes, Senior Engineer, Agilent Technologies
Dana Bergey, Signal Integrity Manager, FCI
Wendem Beyene, Senior Principal Engineer, Rambus
Ajay Bhatia, Senior Design Manager, Apple
Gustavo Blando, Principal Engineer, Oracle
Luis Boluna, Engineering Manager, Microsoft
Eric Bracken, R&D Fellow, ANSYS Inc.
Brad Brim, Product Marketing Manager, Sigrity, Inc.
Michael Brownell, Senior Package and Socket Pathfinding Engineer, Intel Corporation
Dave Brunker, Technical Fellow, Molex
Jeremy Buan, Hirose Electric USA
Jon Burnett, Signal Integrity, Freescale
Pierre Busson, Advanced Architecture and System Expert, STMicroelectronics
Sergio Camerlo, Engineering Director, Ericsson
Maria Agoston, Principal Engineer, Tektronix, Inc.
Ravinder Ajmani, Principal Hardware Engineer, HGST
Mohammad Ali, Principal Scientist, Broadcom
Peerouz Amleshi, Electrical Engineer Manager, Molex
John Andresakis, Vice President of Technology, Oak-Mitsui Technologies
Bruce Archambeault, Distinguished Engineer, IBM
Pervez Aziz, Distinguished Engineer, LSI
Amolak Badesha, Senior R&D Manager, Avago Technologies
Brian Bailey, Consultant, Brian Bailey Consulting
Rula Bakleh, SI/PS Consultant, RBI
Ted Ballou, Senior Analog Engineer, Intel Corporation
Heidi Barnes, Senior Engineer, Agilent Technologies
Dana Bergey, Signal Integrity Manager, FCI
Wendem Beyene, Senior Principal Engineer, Rambus
Ajay Bhatia, Senior Design Manager, Apple
Gustavo Blando, Principal Engineer, Oracle
Luis Boluna, Engineering Manager, Microsoft
Eric Bracken, R&D Fellow, ANSYS Inc.
Brad Brim, Product Marketing Manager, Sigrity, Inc.
Michael Brownell, Senior Package and Socket Pathfinding Engineer, Intel Corporation
Dave Brunker, Technical Fellow, Molex
Jeremy Buan, Hirose Electric USA
Jon Burnett, Signal Integrity, Freescale
Pierre Busson, Advanced Architecture and System Expert, STMicroelectronics
Sergio Camerlo, Engineering Director, Ericsson
Bryan Casper, Principal Engineer, Intel
Robert Carter, Senior Manager of Business Development, Oak-Mitsui Technologies
Federico Centola, EMC Technologist, Apple
Jinhua Chen, Director, Product Development, Tyco Electronics
Raymond Chen, Engineering Group Director, Cadence Design Systems
Xiaohe Chen, Signal Integrity Engineer, Apple
Wheling Cheng, Senior Staff Engineer, Juniper Systems, Inc.
Sam Chitwood, Field Application Engineer Manager, Sigrity, Inc.
Daniel Chow, Principle Signal Integrity Engineer, Altera
Daehyun Chung, Senior Signal Integrity Engineer, nVidia
Antonio Ciccomancini Scogna, Principal Engineer, CST of America
Tom Cohen, Principal Development Engineer, Amphenol-TCS
Sam Connor, Senior Technical Staff Member, IBM
Daniel de Araujo, Director of Applications, Nimbic
Jan deGeest, Senior Signal Integrity R&D Engineer, FCI
Don DeGroot, President & Lead Consultant, CCNI, Inc.
Jim DeLap, Technical Manager - HF East, ANSYS, Inc.
Olivier Despaux, Staff Corporate Applications Engineer, Synopsys
Jay Diepenbrock, Senior Vice President Engineering, High Speed, Lorom Group
Vladimir Dmitriev-Zdorov, Principal Engineer, Mentor Graphics
Xiaoqing Dong, Signal Integrity Research Engineer, Huawei Technologies
David Dunham, SI Director, Molex INC.
Greg Edlund, Senior Engineer, IBM
Robert Carter, Senior Manager of Business Development, Oak-Mitsui Technologies
Federico Centola, EMC Technologist, Apple
Jinhua Chen, Director, Product Development, Tyco Electronics
Raymond Chen, Engineering Group Director, Cadence Design Systems
Xiaohe Chen, Signal Integrity Engineer, Apple
Wheling Cheng, Senior Staff Engineer, Juniper Systems, Inc.
Sam Chitwood, Field Application Engineer Manager, Sigrity, Inc.
Daniel Chow, Principle Signal Integrity Engineer, Altera
Daehyun Chung, Senior Signal Integrity Engineer, nVidia
Antonio Ciccomancini Scogna, Principal Engineer, CST of America
Tom Cohen, Principal Development Engineer, Amphenol-TCS
Sam Connor, Senior Technical Staff Member, IBM
Daniel de Araujo, Director of Applications, Nimbic
Jan deGeest, Senior Signal Integrity R&D Engineer, FCI
Don DeGroot, President & Lead Consultant, CCNI, Inc.
Jim DeLap, Technical Manager - HF East, ANSYS, Inc.
Olivier Despaux, Staff Corporate Applications Engineer, Synopsys
Jay Diepenbrock, Senior Vice President Engineering, High Speed, Lorom Group
Vladimir Dmitriev-Zdorov, Principal Engineer, Mentor Graphics
Xiaoqing Dong, Signal Integrity Research Engineer, Huawei Technologies
David Dunham, SI Director, Molex INC.
Greg Edlund, Senior Engineer, IBM
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F - J
Hany Fahmy, Senior Application Expert, Agilent Technologies
Jun Fan, Assistant Professor, Missouri University of Science & Technology
Saverio Fazzari, Associate, Booz Allen Hamilton
Edward Frlan, Product Definition Specialist, Gennum Corporation
John Grebenkemper, Consultant, TALI Consulting
Xiaoxiong Gu, Research Staff Member, IBM T. J. Watson Research Center
Sanjeev Gupta, Signal Integrity Applications Expert, Avago Technologies
Robert Haller, Hardware Architect, Enterasys Networks
Jun Fan, Assistant Professor, Missouri University of Science & Technology
Saverio Fazzari, Associate, Booz Allen Hamilton
Edward Frlan, Product Definition Specialist, Gennum Corporation
John Grebenkemper, Consultant, TALI Consulting
Xiaoxiong Gu, Research Staff Member, IBM T. J. Watson Research Center
Sanjeev Gupta, Signal Integrity Applications Expert, Avago Technologies
Robert Haller, Hardware Architect, Enterasys Networks
Gert Havermann, Signal Integrity Engineer, HARTING Electronics GmbH&Co.KG
Adam Healey, Distinguished Engineer, LSI Corporation
Shankar Hemmady, Principal Engineer, Synopsys
Jon Hoffman, Senior HDR Engineer, Samtec
Al Horn, Associate Research Fellow, Rogers Corporation
Shamree Howard, Agilent Technologies
Seunghyun Hwang, Senior Signal Integrity Engineer, nVidia
Sachin Idgunji, Principal Engineer, ARM
Alfonso Iniguez, Design Verification Lead, Microchip Technology
Cosmin Iorga, Senior Staff Design Engineer, Inphi Corporation
Adam Healey, Distinguished Engineer, LSI Corporation
Shankar Hemmady, Principal Engineer, Synopsys
Jon Hoffman, Senior HDR Engineer, Samtec
Al Horn, Associate Research Fellow, Rogers Corporation
Shamree Howard, Agilent Technologies
Seunghyun Hwang, Senior Signal Integrity Engineer, nVidia
Sachin Idgunji, Principal Engineer, ARM
Alfonso Iniguez, Design Verification Lead, Microchip Technology
Cosmin Iorga, Senior Staff Design Engineer, Inphi Corporation
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K - O
Sunil Kakkar, President & Chief Architect - VLSI Design, SKAK INC.
Perry Keller, Agilent Technologies
Kumar Keshavan, Serial Channel Specialist, Sigrity
Mario Khalaf, Principal Investigator, Altera
Joong-Ho Kim, Principal Engineer/Technical Director, Xilinx
Namhoon Kim, Senior Staff Signal Integrity Engineer, Xilinx
Woopoung Kim, Engineer, Senior Staff, Qualcomm, Inc
Vikas Kohli, Architect, Cadence Design Systems
Ravi Kollipara, Senior Principal Engineer, Rambus
James Kruchowski, Senior Scientist, Mayo Clinic
An-Yu Kuo, Director, Thermal & Mechanical Products, Sigrity, Inc.
Young Kwark, Research Staff Member, IBM T. J. Watson Research Center
Greg Le Cheminant, Measurement Applications Engineer, Agilent Technologies
Beomtaek Lee, Principal Engineer, Intel Corporation
Mike Peng Li, Principal Architect, Altera Corporation
Zhe Li, Engineer, Altera
Feng Ling, CEO, Xpeedic Technology, Inc.
Cathy Liu, Distinguished Engineer, LSI
Chris Loberg, Senior Manager, Tektronix, Inc.
Om Mandhana, Senior Staff Product Engineer, Cadence Design Systems
Henri Maramis, Technology Architecture Manager, Intel
Mark Marlett, Director of Engineering, Analog Bits
Jon Martens, fellow, Anritsu
Perry Keller, Agilent Technologies
Kumar Keshavan, Serial Channel Specialist, Sigrity
Mario Khalaf, Principal Investigator, Altera
Joong-Ho Kim, Principal Engineer/Technical Director, Xilinx
Namhoon Kim, Senior Staff Signal Integrity Engineer, Xilinx
Woopoung Kim, Engineer, Senior Staff, Qualcomm, Inc
Vikas Kohli, Architect, Cadence Design Systems
Ravi Kollipara, Senior Principal Engineer, Rambus
James Kruchowski, Senior Scientist, Mayo Clinic
An-Yu Kuo, Director, Thermal & Mechanical Products, Sigrity, Inc.
Young Kwark, Research Staff Member, IBM T. J. Watson Research Center
Greg Le Cheminant, Measurement Applications Engineer, Agilent Technologies
Beomtaek Lee, Principal Engineer, Intel Corporation
Mike Peng Li, Principal Architect, Altera Corporation
Zhe Li, Engineer, Altera
Feng Ling, CEO, Xpeedic Technology, Inc.
Cathy Liu, Distinguished Engineer, LSI
Chris Loberg, Senior Manager, Tektronix, Inc.
Om Mandhana, Senior Staff Product Engineer, Cadence Design Systems
Henri Maramis, Technology Architecture Manager, Intel
Mark Marlett, Director of Engineering, Analog Bits
Jon Martens, fellow, Anritsu
Jason Miller, Senior Staff Engineer, Oracle
Martin Miller, Chief Scientist, Teledyne-LeCroy
Michael Miller, VP of Technology Innovation and System Applications, MoSys, Inc.
Mohammad Mobin, Distinguished Engineer, LSI Corporation
Shahriar Mokhtarzad, Signal Integrity manager, Brocade Inc
Heather Monigan, Senior Analog Engineer, Intel
Jose Moreira, Senior R&D Engineer, Advantest
Amir H. Motamedi, Principal Engineer, Aruba Networks
Zhen Mu, Product Marketing Manager, Mentor Graphics
Muris Mujagic, R&D, Simulation and Modeling, National Instruments
Souvik Mukherjee, Signal Integrity Engineer, Texas Instruments, Inc.
Jim Nadolny, Senior SI and EMI Specialist, Samtec, Inc.
Deepukumar Nair, Engineer, DuPont Electronics & Communications
Alfred Neves, Engineer, Wild River Technology LLC
Mladen Nizic, Engineering Director, Cadence Design
George Noh, Sales and Marketing Director, Holt Integrated Circuits, Inc.
Istvan Novak, Distinguished Engineer, Oracle
Chudy Nwachukwu, Electrical Application Development Engineer, Isola Group, USA
Gourgen Oganessyan, Staff Product Marketing Engineer, Intersil Corp.
Dan Oh, Signal and Power Integrity Architect, Altera Corporation
Glenn Oliver, Research & Development Engineer, DuPont Electronic Technologies
Martin Miller, Chief Scientist, Teledyne-LeCroy
Michael Miller, VP of Technology Innovation and System Applications, MoSys, Inc.
Mohammad Mobin, Distinguished Engineer, LSI Corporation
Shahriar Mokhtarzad, Signal Integrity manager, Brocade Inc
Heather Monigan, Senior Analog Engineer, Intel
Jose Moreira, Senior R&D Engineer, Advantest
Amir H. Motamedi, Principal Engineer, Aruba Networks
Zhen Mu, Product Marketing Manager, Mentor Graphics
Muris Mujagic, R&D, Simulation and Modeling, National Instruments
Souvik Mukherjee, Signal Integrity Engineer, Texas Instruments, Inc.
Jim Nadolny, Senior SI and EMI Specialist, Samtec, Inc.
Deepukumar Nair, Engineer, DuPont Electronics & Communications
Alfred Neves, Engineer, Wild River Technology LLC
Mladen Nizic, Engineering Director, Cadence Design
George Noh, Sales and Marketing Director, Holt Integrated Circuits, Inc.
Istvan Novak, Distinguished Engineer, Oracle
Chudy Nwachukwu, Electrical Application Development Engineer, Isola Group, USA
Gourgen Oganessyan, Staff Product Marketing Engineer, Intersil Corp.
Dan Oh, Signal and Power Integrity Architect, Altera Corporation
Glenn Oliver, Research & Development Engineer, DuPont Electronic Technologies
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P - T
Vishram Pandit, Power Integrity Engineer, Intel
Pravin Patel, STSM, IBM Master Inventor, IBM
John Plasterer, Manager, Mixed Signal Development, PMC-Sierra
Peter Pupalaikis, VP & Principal Technologist, LeCroy Corporation
Kelvin Qiu, Senior signal integrity engineer, Cisco
Shafiq Rahman, Technical Staff Member, Hewlett-Packard
Suresh Rajgopal, Senior Principal Engineer, Micron Technology, Inc.
Fangyi Rao, R&D Engineer, Agilent Technologies
Mike Resso, Signal Integrity Specialist, Agilent Technologies
Lee Ritchey, President, Speeding Edge
Gerardo Romo, Senior RF/SI Engineer, Qualcomm Inc.
Woong Hwan Ryu, Manager, Signal/Power Integrity, Samsung
Mike Sapozhnikov, Technical Leader, Cisco Systems Inc.
Venkat Satagopan, Senior Signal Integrity Engineer, nVidia
Robert Schaefer, SI R&D Project Manager, Agilent Technologies
Martin Schauer, Principal Application Engineer, CST of America
Ralf Schmitt, Senior Engineering Manager, Rambus Inc.
Christian Schuster, Professor, Technical University Hamburg-Harburg
Stefaan Sercu, Signal Integrity R&D Manager, FCI
Yogesh Sharma, MDG Signal Integrity Manager, Micron Technology, Inc.
Bharat Shenoy, Director of Technical Marketing, Littelfuse
Pravin Patel, STSM, IBM Master Inventor, IBM
John Plasterer, Manager, Mixed Signal Development, PMC-Sierra
Peter Pupalaikis, VP & Principal Technologist, LeCroy Corporation
Kelvin Qiu, Senior signal integrity engineer, Cisco
Shafiq Rahman, Technical Staff Member, Hewlett-Packard
Suresh Rajgopal, Senior Principal Engineer, Micron Technology, Inc.
Fangyi Rao, R&D Engineer, Agilent Technologies
Mike Resso, Signal Integrity Specialist, Agilent Technologies
Lee Ritchey, President, Speeding Edge
Gerardo Romo, Senior RF/SI Engineer, Qualcomm Inc.
Woong Hwan Ryu, Manager, Signal/Power Integrity, Samsung
Mike Sapozhnikov, Technical Leader, Cisco Systems Inc.
Venkat Satagopan, Senior Signal Integrity Engineer, nVidia
Robert Schaefer, SI R&D Project Manager, Agilent Technologies
Martin Schauer, Principal Application Engineer, CST of America
Ralf Schmitt, Senior Engineering Manager, Rambus Inc.
Christian Schuster, Professor, Technical University Hamburg-Harburg
Stefaan Sercu, Signal Integrity R&D Manager, FCI
Yogesh Sharma, MDG Signal Integrity Manager, Micron Technology, Inc.
Bharat Shenoy, Director of Technical Marketing, Littelfuse
Yuriy Shlepnev, President, Simberian, Inc.
Larry Smith, Principal Engineer, Qualcomm
Chad Smutzer, Senior Engineer, Mayo Clinic
Marty Spadaro, Senior System Applications Engineer, Vitesse Semiconductor Corporation
Michael Steinberger, Lead Architect, SiSoft
Oleg Stepanov, R&D, Simulation and Modeling, National Instruments
Ransom Stephens, Applied Electrodynamics Scientist, Ransom's Notes
Sam Stephens, Member of Technical Staff, AMD
Peter Stonard, Application Engineer, NXP Semiconductors
Suresh Subramaniam, Senior Staff Engineer, Tabula, Inc.
Sunil Sudhakaran, Hardware Engineering Manager, nVidia
Shishuang Sun, Senior Member of Technical Staff, Altera
Toshiyuki Takada, Manager, Signal Integrity, Hirose Electric USA
Yuming Tao, Senior engineer, PMC-Sierra
Donald Telian, SI Consultant, SiGuys
Luke Teyssier, Senior Principal Engineer, Cryptography Research, Inc.
Helene Thibieroz, Staff Technical Marketing Manager, Synopsys
Lars Thon, Consultant, LT Engineering
Benjamin Ting, Xilinx
Peter Tomaszewski, Principal Hardware Engineer,
Francois Tremblay, Director of Design Engineering, Gennum
Larry Smith, Principal Engineer, Qualcomm
Chad Smutzer, Senior Engineer, Mayo Clinic
Marty Spadaro, Senior System Applications Engineer, Vitesse Semiconductor Corporation
Michael Steinberger, Lead Architect, SiSoft
Oleg Stepanov, R&D, Simulation and Modeling, National Instruments
Ransom Stephens, Applied Electrodynamics Scientist, Ransom's Notes
Sam Stephens, Member of Technical Staff, AMD
Peter Stonard, Application Engineer, NXP Semiconductors
Suresh Subramaniam, Senior Staff Engineer, Tabula, Inc.
Sunil Sudhakaran, Hardware Engineering Manager, nVidia
Shishuang Sun, Senior Member of Technical Staff, Altera
Toshiyuki Takada, Manager, Signal Integrity, Hirose Electric USA
Yuming Tao, Senior engineer, PMC-Sierra
Donald Telian, SI Consultant, SiGuys
Luke Teyssier, Senior Principal Engineer, Cryptography Research, Inc.
Helene Thibieroz, Staff Technical Marketing Manager, Synopsys
Lars Thon, Consultant, LT Engineering
Benjamin Ting, Xilinx
Peter Tomaszewski, Principal Hardware Engineer,
Francois Tremblay, Director of Design Engineering, Gennum
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U - Z
Mahesh Umasankar, Director, Platform Applications Group , Xilinx
Arun Vaidyanath, Senior Engineering Manager, Rambus Inc.
Ambrish Varma, Member of Consulting Staff, Cadence Design Systems
Tanit Virutchapunt, Power Integrity Specialist, Sigrity, Inc.
Scott Wedge, Senior Staff Engineer, Synopsys, Inc.
Kathy Werner, IP Strategy and Business Manager, Freescale Semiconductor
Todd Westerhoff, Vice President, SiSoft
David Wiens, Product Marketing Manager, Mentor Graphics
Ken Willis, Product Marketing Manager, Sigrity
Markus Witte, Director, Harting Electronics Gmbh & Co. Kg
Randy Wolff, Signal Integrity Modeling Manager, Micron Technology, Inc
Henry Wong, Principal Engineer, Gennum
Chris Wyland, Manager, Xilinx
Arun Vaidyanath, Senior Engineering Manager, Rambus Inc.
Ambrish Varma, Member of Consulting Staff, Cadence Design Systems
Tanit Virutchapunt, Power Integrity Specialist, Sigrity, Inc.
Scott Wedge, Senior Staff Engineer, Synopsys, Inc.
Kathy Werner, IP Strategy and Business Manager, Freescale Semiconductor
Todd Westerhoff, Vice President, SiSoft
David Wiens, Product Marketing Manager, Mentor Graphics
Ken Willis, Product Marketing Manager, Sigrity
Markus Witte, Director, Harting Electronics Gmbh & Co. Kg
Randy Wolff, Signal Integrity Modeling Manager, Micron Technology, Inc
Henry Wong, Principal Engineer, Gennum
Chris Wyland, Manager, Xilinx
Douglas Yanagawa, Technical Lead, Cisco Systems
Ling Yang, Senior Member of Technical Staff, Rambus Inc.
Yao Chao Yang, Senior Hardware Manager, Cisco Systems
Zhiping Yang, Senior Manager Hardware Engineering, Cisco Systems
Mobashar Yazdani, Strategic Silicon Manager, Google, Inc.
Xiaoning Ye, Senior Analog Engineer, Intel
Chris Young, Senior Manager, Digital Power Technology, Intersil
Arch Zaliznyak, Manager, Design Engineering, Altera
Iliya Zamek, Principal Product and Test Engineer, Inphi Corp.
Jared Zerbe, Engineering Director, Rambus, Inc.
Geoffrey Zhang, CTO (Interconnect), Huawei Technologies
Jianmin Zhang, Senior Signal Integrity Engineer, Cisco Systems
Xiaonan Zhang, Director of Engineering, Qualcomm, Inc
Pavel Zivny, Product Engineer, Tektronix, Inc.
Ling Yang, Senior Member of Technical Staff, Rambus Inc.
Yao Chao Yang, Senior Hardware Manager, Cisco Systems
Zhiping Yang, Senior Manager Hardware Engineering, Cisco Systems
Mobashar Yazdani, Strategic Silicon Manager, Google, Inc.
Xiaoning Ye, Senior Analog Engineer, Intel
Chris Young, Senior Manager, Digital Power Technology, Intersil
Arch Zaliznyak, Manager, Design Engineering, Altera
Iliya Zamek, Principal Product and Test Engineer, Inphi Corp.
Jared Zerbe, Engineering Director, Rambus, Inc.
Geoffrey Zhang, CTO (Interconnect), Huawei Technologies
Jianmin Zhang, Senior Signal Integrity Engineer, Cisco Systems
Xiaonan Zhang, Director of Engineering, Qualcomm, Inc
Pavel Zivny, Product Engineer, Tektronix, Inc.