• Conference
    Jan 31-Feb 2, 2017
  • Expo
    Feb 1-2, 2017
  • Santa Clara, CA
    Santa Clara Convention Center

Technical Program Committee

The DesignCon 2016 Technical Program Committee is comprised of more than 80 leading experts in all levels of electronic design – chip, board, package and system – dedicated to the DesignCon standard for excellence. Their contributions, including the review of abstracts and papers, are critical to the technical program and ensure the speakers and topics at DesignCon are of the highest quality and relevance.

A - E

Brice AchkirCisco Distinguished Engineer, Cisco
Maria AgostonPrincipal Engineer, Tektronix
Kunia AiharaSr. Signal Integrity Engineer, Hirose Electric
Ravinder AjmaniPrincipal Hardware Engineer, HGST
John AndresakisVP Of Strategic Technology, Oak-Mitsui Technologies
Bruce ArchambeaultDistinguished Engineer, MS&T
Rula BaklehSI/PI Consultant, Teraspeed Consulting
Heidi BarnesApplications Engineer, Keysight Technologies
Dana BergeySignal Integrity Manager, FCI
Todd BermensoloSr Analog Engineer & Manager, Intel
Wendem BeyeneTechnical Director, Rambus
Brad BrimSr Staff Product Engineer, Cadence Design Systems
David BrunkerTechnical Fellow, Molex
Jeremy BuanSenior Signal Integrity Engineer, Hirose Electric
Robert CarterSenior Director Of Budiness Development And Technology, Oak-Mitsui Technologies
Wheling ChengSr. Manager, Hardware Engineering, Ericsson
Chris ChengDistinguished Technologist, HP
Sam ChitwoodProduct Engineer, Cadence
Antonio Ciccomancini ScognaPrincipal Engineer, CST
Tom CohenPrincipal Engineer, Amphenol-tcs
Jan De GeestSenior Staff SI R&D Engineer, FCI
Jay DiepenbrockSenior VP, High Speed Engineering, Lorom America
Vladimir Dmitriev-ZdorovPrincipal Engineer, Mentor Graphics
Greg EdlundSenior Engineer, IBM

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F - J

Sanjeev GuptaSr. R&D Manager, Avago Technologies
Robert HallerSr. Principal Hardware Engineer, Extreme Networks
Gert HavermnnSignal Integrity Engineer, HARTING Electronics GmbH
Tim HollisSignal Integrity R&D, Micron
Allen F. Horn IIIAssociate Research Fellow, Rogers
Seunghyun HwangSr. Signal & Power Integrity Engineer, Nvidia
Sachin IdgunjiGPU Power Architect, NVIDIA
Cosmin IorgaPrincipal Design Engineer, Inphi

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K - O

Namhoon KimSr. Principal Signal Integrity Engineer, Broadcom
Vikas KohliSr Software Architect, Cadence Design System
Ravi KolliparaTechnical Director, Rambus Inc
An-Yu KuoEngineering Group Director, Cadence Design Solutions
Beomtaek LeeSr. Principal Engineer, Intel
Joy LiProduce Engineer, Cadence
Mike Peng LiFellow, Altera
Cathy LiuR&D Director, Avago Technologies
Chris LobergSr. Technical Marketing Manager, Tektronix
Om MandhanaSr. Memeber Of Technical Staff, Cadence Design Systems
Henri MaramisPresident/CEO, Signata
Jon MartensFellow, Anritsu
Schauer MartinEngineering Manager, CST
Mehdi MechaikSenior Technical Staff Member, IBM Corp.
Ted MidoPrincipal Engineer, Synopsys Inc.
Martin MillerChief Scientist, Teledyne-LeCroy
Jose MoreiraSenior Staff Engineer, Advantest
Zhen MuSr. Principal Product Engineer, Cadence Design Systems
Jim NadolnySr. SI & EMI Engineer, Samtec
Al NevesChief Technologist, Wild River Technology
George NohDirector Of Sales And Marketing, Holt Integrated Circuits
Istvan NovakSenior Principal Engineer, Oracle
Dan OhArchitect, Altera
Glenn OliverSenior Engineer, DuPont

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P - T

Vishram Pandit, Engineering Manager, Intel Corporation
Peter Pupalaikis, Vice President, Technology Development, Teledyne LeCroy
Mike Resso, Signal Integrity Applications Scientist, Keysight Technologies
Lee Ritchey, President, Speeding Edge
Gerardo Romo Luevano, Staff Engineer/Manager, Qualcomm Tech Inc.
Steve Sandler, Director, PICOTEST
Chris Scholz, PM, Rohde & Schwarz
Christian Schuster, Professor, TUHH
Stefaan Sercu, Principle SI Engineer, Samtec
Yuriy Shlepnev, President, Simberian Inc.
Chad Smutzer, Senior Engineer II, Mayo Clinic
Michael Steinberger, Lead Architect, Serial Channel Products, SiSoft
Ransom Stephens, Staff Deity, Ransom's Notes
Suresh Subramaniam, Director Of Engineering, Whizz Systems
Donald Telian, Consultant, SiGuys
Lars Thon, Consultant, LT Engineering
Peter Tomaszweski, Field Applications Engineer, Tektronix
Takada Toshiyuki, Manager, Signal Integrity, Hirose Electric USA

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U - Z

Ambrish Varma, Principal Software Engineer, Cadence
Harald Von Sosen, Principal Engineer, Synopsys
Min Wang, Senior Engineering Manager, Intel
Yong Wang, Director Of Engineering, Xilinx Inc.
Scott Wedge, Sr. Staff Engineer, Synopsys
Beyene Wemde, Technical Director, Rambus
Todd Westerhoff, VP, Semiconductor Relations, SiSoft
Ken Willis, Product Engineering Director, Cadence
Randy Wolff, Principal Engineer, Silicon SI Group Lead, Micron Technology
Hsinho Wu, Principal Design Engineer, Altera
Kenneth Wyatt, President, Wyatt Technical Services
Chris Wyland, CEO, Wyland Consulting
Mobashar Yazdani, Strategic Silicon Manager, Google Inc
Iliya Zamek, Consultant, ZI Consulting
Geoff Zhang, Director , Xilinx
Li Zhe, Senior Staff, Altera Corp
Pavel Zivny, Domain Expert, HS Oscilloscope Acquisition And Serial Data Measurement, Tektronix

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