Best Paper Awards

DesignCon Paper Awards recognize outstanding contributions to the educational goals of the DesignCon program. Papers are judged both on the merits of the written document and on the quality of their presentation at DesignCon. The Awards serve to acknowledge the authors who receive them as leading practitioners in semiconductor and electronic design. The Awards also provide incentive to authors to produce high-quality DesignCon papers and present them in a lucid and compelling manner.

DesignCon Paper Award recipients are selected through a two-prong process. The first step is a review of the full-length papers accepted for the current year's program. Members of the DesignCon Technical Program Committee rank these papers based on quality, relevance, impact, originality, and commercial content, which determines the finalists for each award category. While selection as a finalist for a DesignCon Paper Award is a notable achievement in itself, winners are then chosen from the finalists based on the quality of their presentations. Presentation quality is judged based on audience feedback collected at DesignCon.

DesignCon 2016

Best Paper Awards

High-Speed Signal Design

"A Versatile Spectrum Shaping Scheme for Communicating Beyond Notches in Multi-Drop Interfaces"
Ali Hormati, Kandou Bus, Switzerland
Armin Tajalli, Kandou Bus, Switzerland
Christoph Walter, Kandou Bus, Switzerland
Kiarash Gharibdoust, EPFL, Switzerland
Amin Shokrollahi, Kandou Bus, Switzerland

"Mid-Frequency Noise Coupling Between DC-DC Converters and High-Speed Signals"
Laura Kocubinski, Oracle
Gustavo Blando, Oracle
Istvan Novak, Oracle

Memory & Parallel Interfaces

"Analysis and Verification of DDR3/DDR4 Board Channel Impact on Clock Duty-Cycle-Distortion (DCD)"
GaWon Kim, Altera
June Feng, Altera
Marjan Mokhtaari, Altera
David Lieby, Altera
Janmejay Adhyaru, Altera
Balaji Natarajan, Altera
Dan Oh, Altera

"Optimal DDR4 System with Data Bus Inversion Feature in FPGA High Speed High Bandwidth Memory Interface"
Thomas To, Xilinx
Changyi Su, Xilinx
Juan Wang, Xilinx
Penglin Niu, Xilinx
Yong Wang, Xilinx



Test & Measurement

"Jitter, Noise Analysis and BER Synthesis on PAM4 Signals on 400 Gbps Communication Links"
Maria Agoston, Tektronix
Mark L. Guenther, Tektronix
Richard J. Poulo, Tektronix
Kalev Sepp, Tektronix
Pavel Zivny, Tektronix

"BER- and COM-Way Channel Compliance Evaluation: What are the Sources of Difference?"
Vladimir Dmitriev-Zdorov, Mentor Graphics
Cristian Filip, Mentor Graphics
Chuck Ferry, Mentor Graphics
Alfred P. Neves, WildRiver Technology

"A New Characterization Technique for Glass Weave Skew Sensitivity"
Eric Bogatin, Teledyne LeCroy
Bill Hargin, Nan Ya Plastics
Vinit Sonawane, Univ. of Colorado, Boulder
Sanket Sapre, Univ. of Colorado, Boulder
Vidyadhar Yashwant Deodhar, Univ. of Colorado, Boulder
Nikhil Joshi, Univ. of Colorado, Boulder
Anand Ursekar, Univ. of Colorado, Boulder

Power Integrity

"Impacts of Dynamic Noise in Multi-Core or SOC Designs"
Yujeong Shim, Altera
Dan Oh, Altera

"Electrical and Thermal Consequences of Non-Flat Impedance Profiles"
Jae Young Choi, Oracle
Ethan Koether, Oracle
Istvan Novak, Oracle

"Chip and Package-Level Wideband EMI Analysis for Mobile DRAM Devices"
Jin-Sung Youn, Samsung Electronics
Jieun Park, Samsung Electronics
Jinwon Kim, Samsung Electronics
Daehee Lee, Samsung Electronics
Sangnam Jeong, Samsung Electronics
Junho Lee, Samsung Electronics
Hyo-Soon Kang, Samsung Electronics
Chan-Seok Hwang, Samsung Electronics
Jong-Bae Lee, Samsung Electronics



2015 Paper Award Winners

MODELING & SIMULATION

"Behavioral Modeling of Random Jitter with Realistic Time and Frequency Dependence"
Scott Wedge, Synopsys, Inc.
"Package Simulations For Mitigating Noise Coupling Onto Sensitive RF Signals"
Dmitry Fliter, CSR
Nir Malka, CSR

"Practical Method for Modeling Conductor Surface Roughness Using Close Packing of Equal Spheres"
Bert Simonovich, Lamsim Enterprises Inc.



HIGH-SPEED SIGNAL DESIGN

"Does Skew Really Degrade SERDES Performance?"

Li Ying, Oracle
Vijay Kunda, Oracle
Shirin Farrahi, Oracle
Xun Zhang, Oracle
Gustavo Blando, Oracle
Istvan Novak, Oracle

"A Simple And Innovative Circuit Technique To Tackle Power Supply Induced Jitter In High Speed Serial Links For 25Gbps Transmission And Beyond"

Yujeong Shim, Altera Corporation
Dan Oh, Altera Corporation

"56+ Gb/s Serial Transmission using Duo-binary Signaling"
Timothy De Keulenaer, INTEC-IMEC
Jan De Geest, FCI
Guy Torfs, INTEC-IMEC
Johan Bauwelinck, Ghent University/iMinds
Yu Ban, INTEC-IMEC
Jeffrey Sinsky, Alcatel-Lucent
Bartek Kozicki, Alcatel-Lucent



POWER INTEGRITY & SIGNAL INTEGRITY

"Vectorless Prediction of Simultaneous Switching Noise from FPGAs"
Chunchun Sui, Missouri University of Science and Technology
"Optimization of PCB Capacitors for Signal Integrity Performance in Mixed Reference Channels"
Gerardo Romo Luevano, Qualcomm Technology Inc.
Martin Schauer, CST of America
Darryl Kostka, CST of America
Selman Ozbayat, Qualcomm Technology Inc.



TEST & MEASUREMENT

"100 Gb/s Ethernet 100GBASE-CR4 Test Points and Test Fixtures"
Christopher DiMinico, MC Communications
Mike Sapozhnikov, Cisco Systems
Mike Resso, Keysight Technologies
"One-Sided Measurement of Power Supply Impedance Without Connectors"
Joachim Held, Siemens AG
Richard Sjiariel, CST


2014 Paper Award Winners

Chip-Level Design Category

“Converting Verilog/SystemVerilog to C++ for Usage with Data Flow Simulator and IBIS-AMI”
Zao Liu, Intel Corporation
Miguel Yanez, Jr., Intel Corporation
Torstein Molvik, Intel Corporation
Todd Bermensolo, Intel Corporation
“Measured Random Jitter in a 300 Gbit Optical Data Link using a Chip-scale FBAR Oscillator for the Reference Clock”
Richard Ruby, Avago Technologies
Andrew Seidel, Avago Technologies
Sanjeev Gupta, Avago Technologies


Board and System Design Category

“Power Integrity Analysis of Chip-Package-System (CPS) of a Mobile AP using Extended CPM Technique”
Kyoungchoul Koo, Samsung Electronics Inc.
Youngsoo Lee, Samsung Electronics Inc.
Woncheol Baek, Samsung Electronics Inc.
“Practical Design Considerations for Dense, High-Speed, Differential Stripline PCB Routing Related to Bends, Meanders and Jog-outs”
Michael Degerstrom, Mayo Clinic
Chad Smutzer, Mayo Clinic
Barry Gilbert, Mayo Clinic
Erik Daniel, Mayo Clinic


High-Speed Design Category

“The Road to 1TBps Bandwidth Systems: A Case Study”
Prathap Muthana, NVIDIA Corporation
Daehyun Chung, NVIDIA Corporation
Venkat Satagopan, NVIDIA Corporation
Daniel Lin, NVIDIA Corporation
“Modulation, Equalization, and Forward Error Correction Coding Technologies for a 56 Gbps Chip-to-Module Link”
Adam Healey, LSI Corporation
Cathy Liu, LSI Corporation


Interconnect Design & Test Category

“Moving Higher Data Rate Serial Links into Production - Issues & Solutions”
Donald Telian, SiGuys
Sergio Camerlo, Ericsson
Kusuma Matta, Ericsson
Michael Steinberger, SiSoft
Barry Katz, SiSoft
Walter Katz, SiSoft
“Real-Time Jitter Measurement”
Michael Schnecker, Rohde & Schwarz


Power and RF Design Category

“Analysis and Correlations of Supply Noise and Jitter Impact on DDR3L Memory Interface”
Jayong Koo, Intel Corporation
Jongbae Park, Intel Corporation
Almario Delos Angeles, Intel Corporation
Vishram Pandit, Intel Corporation
“Quantitative EMI Analysis of Electrical connectors Using Simulation Models”
Michael Rowlands, Molex
Alpesh Bhobe, Cisco Systems, Inc.
Patrick Casher, Molex
Xiao Li, Cisco Systems, Inc.


2013 PAPER AWARD WINNERS

Chip-Level Design Category

"3D Si Interposer Design and Electrical Performance Study"

Mandy (Ying) Ji, Rambus
Ming Li, Rambus
Julia Cline, Rambus
David Secker, Rambus
Kevin Cai, Rambus
John Lau, ITRI
Pei-Jer Tzeng, ITRI
Chau-Jie Zhan, ITRI
Ching-Kuan Lee, ITRI

"Applying Microwave Techniques to Digital Systems - A Simple Case Study"

Andrew Becker, Cray
Michael Higgins, Cray
Michael Steinberger, SiSoft
Paul Wildes, SiSoft



Board and System Design Category

"Simulating Simultaneous Switching Noise with IBIS v5.0 Models"

Romi Mayder, Xilinx
Chris Wyland, Xilinx
Bradley Brim, Cadence
Yingxin Sun, Cadence

"Analytic Solutions for Periodically Loaded Transmission Line Modeling"

Priya Pathmanathan, Intel
Paul Huray, University of South Carolina
Steve Pytel, ANSYS



High-Speed Design Category

"Dramatic Noise Reduction using Guard Traces with Optimized Shorting Vias"

Eric Bogatin, Bogatin Enterprises
Lambert Simonovich, Lamsim Enterprises

"Partial Response and Noise Predictive Maximum Likelihood (PRML/NPML) Equalization and Detection for High Speed Serial Link Systems"

Pervez Aziz, LSI
Cathy Ye Liu, LSI
Adam Healey, LSI



Interconnect Design & Test Category

"Beyond 25 Gbps: A Study of NRZ & Multi-Level Modulation in Alternative Backplane Architectures"

Adam Healey, LSI
Chad Morgan, TE Connectivity
Megha Shanbhag, TE Connectivity

"High-Throughput, High-Sensitivity Measurement of Power Supply-Induced Bounded, Uncorrelated Jitter in Time, Frequency, and Statistical Domains"

Daniel Chow, Altera
Yujeong Shim, Altera
Shishuang Sun, Altera



Power and RF Design Category

"Validating EMC Simulation by Measurement in Reverberation Chamber"

Xiaoxia Zhou, Cisco Systems
Jing Li, Cisco Systems
Hongmei Fan, Cisco Systems
Alpesh Bhobe, Cisco Systems
Kam Taunk, Cisco Systems
Jinghan Yu, Cisco Systems
Philippe Sochoux, Cisco Systems

"Effects of Ground Via Asymmetry on Mode Conversion for High Speed Differential Signals"

Alma Jaze, IBM
Bruce Archambeault, IBM
Sam Connor, IBM