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2013 Paper Award Winners

Chip-Level Design Category

"3D Si Interposer Design and Electrical Performance Study"

Mandy (Ying) Ji, Rambus
Ming Li, Rambus
Julia Cline, Rambus
David Secker, Rambus
Kevin Cai, Rambus
John Lau, ITRI
Pei-Jer Tzeng, ITRI
Chau-Jie Zhan, ITRI
Ching-Kuan Lee, ITRI

"Applying Microwave Techniques to Digital Systems - A Simple Case Study"

Andrew Becker, Cray
Michael Higgins, Cray
Michael Steinberger, SiSoft
Paul Wildes, SiSoft


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Board and System Design Category

"Simulating Simultaneous Switching Noise with IBIS v5.0 Models"

Romi Mayder, Xilinx
Chris Wyland, Xilinx
Bradley Brim, Cadence
Yingxin Sun, Cadence

"Analytic Solutions for Periodically Loaded Transmission Line Modeling"

Priya Pathmanathan, Intel
Paul Huray, University of South Carolina
Steve Pytel, ANSYS


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High-Speed Design Category

"Dramatic Noise Reduction using Guard Traces with Optimized Shorting Vias"

Eric Bogatin, Bogatin Enterprises
Lambert Simonovich, Lamsim Enterprises


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Interconnect Design & Test Category


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Power and RF Design Category

"Validating EMC Simulation by Measurement in Reverberation Chamber"

Xiaoxia Zhou, Cisco Systems
Jing Li, Cisco Systems
Hongmei Fan, Cisco Systems
Alpesh Bhobe, Cisco Systems
Kam Taunk, Cisco Systems
Jinghan Yu, Cisco Systems
Philippe Sochoux, Cisco Systems


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