DesignCon 2016 promises to address the latest signal integrity and power integrity challenges for engineers working in high-speed designs. From design, to prototype, to test & measurement and validation, DesignCon 2016 has you covered as you optimize the signals and power in your complex chip, board, and system designs.
Every year, the top signal integrity, power integrity, and high-speed design experts present their insights and results at DesignCon. Each abstract and paper submitted to DesignCon is read and evaluated by a team of engineers from DesignCon's Technical Program Committee. The very best papers are nominated for Best Paper Awards, and from those nominees, the winners are selected by considering both the paper review score as well as the score given by attendees at the presentation.
This resource section contains all the titles and abstracts from previous DesignCon conferences for your reference. Attendees of these conferences can request access to the papers in their entirety click here for more information.
Taking place annually in Silicon Valley, DesignCon was created by engineers for engineers and remains the largest gathering of chip, board and systems designers in the country. Combining technical paper sessions, tutorials, industry panels, product demos and exhibits, DesignCon brings engineers the latest theories, methodologies, techniques, applications and demonstrations on PCB design tools, power and signal integrity, jitter and crosstalk, high-speed serial design, test and measurement tools, parallel and memory interface design, ICs, semiconductor components and more.
DesignCon enables chip, board and systems designers, software developers, silicon manufacturers and other engineers to: