Jan 30-Feb 1, 2018
Jan 31-Feb 1, 2018
- Santa Clara Convention
Center | Santa Clara, CA
ANSYS’ new Chip-Package-System (CPS) design flow delivers unparalleled simulation capacity and speed for power integrity, signal integrity EMI, ESD and thermal stress challenges. ANSYS’ unique layout assembly capability integrates IC package layout, interposers, connectors, ribbon cables, flex cables, and PCB all within a single assembly. This facilitates the emerging CPS design process to support new and existing electronic devices. Automated thermal analysis and integrated structural analysis capabilities provide coupled chip-aware and system-aware simulation for CPS design enabling customers to perform end-to-end multiphysics analysis.
EquipNet’s Asset Redeployment Management System, known as ARMS, is a secure web-based asset management software that provides companies with the ability to post, track, find, redeploy, buy and sell surplus or idle equipment. ARMS offers workflow management capabilities and a number of security levels for plant managers and executives across the enterprise. Companies in a number of industries utilize EquipNet ARMS for asset tracking and management in various facilities across the globe. Some of the benefits of ARMS include, but are not limited to: customization, visibility, cost savings, streamlining communication, tracking success, data security, maintaining control and compliance and reliable support.
1. Ultra-thin, space saving design, free you design from mechanism limitations.
2. Back Flip design, Prevent FPC cable falling out.
3. The Actuator is firm but convenient to open, reducing assembly difficulty and providing a strong locking force.
World's fastest high resolution (60 microns) EMC/EMI scanner.
EMxpert is a real-time, compact, bench-top EMC/EMI diagnostic tool enabling designers to rapidly diagnose & solve EMC/EMI problems in a single design cycle. Gain insights about why designs fail something no chamber can give you. No more waiting for chamber time to redesign & test by trial & error. The EMxpert rapidly diagnoses even intermittent problems, which may go undetected when using handheld and automated probes.
EMxpert is 1/10th of a chamber’s cost and operate 100 times faster.
* Fast PCB emission testing
* High resolution 0.06 mm
* 150 kHz to 8 GHz
Gigatest Labs developed the GTL65_Series and GTL40_Series of microwave probes to solve the recurring problem engineers experience with probe tip breakage when contacting non-planar PCB surfaces. The optimized design of the GTL65 and 40_Series Microwave probes provides the durability, contact compliance, and long-life span for day-to-day engineering measurement tasks.
High Bandwidth Memory (HBM2)
High Bandwidth Memory (HBM2) is a high performance 3D-stacked memory solution that leverages the 2.5D technology. The high-performance memory interface uses a wide-interface architecture that allows in achieving very high bandwidth, low power and significantly small form factor. The HBM2 has been adopted by JEDEC as an industry standard.
HBM2 Subsystem IP Solution
Open-Silicon’s subsystem IP solution comprises of the HBM2 Controller, PHY and 2.5D interposer IO thereby addressing interoperability and 2.5D design, test and SiP packaging challenges. The HBM2 IP is suitable for applications involving graphics, high-performance computing, high-end networking and communication that require low power and small form factor that are critical to the application.
Pacific Microchip Corp. is developing a highly energy efficient 56GS/s ADC with ENOB > 6-bit. The ADC will be packaged on a high performance chip carrier, which was previously developed and used for an ADC array producing a serial 32 Gb/s data at the output. Pacific Microchip Corp. plans to offer the developed ADC as a component as well as an IP block for integration into ASICs and SoCs.
Gigatest Labs pioneered the use of RF and microwave measurement techniques for SI applications. Today, our engineering expertise includes Agilent Technologies ADS suite of modeling and simuplation tools, CST 3-D simulation tools, and lab measurements, differentially, and single-ended, to 67GHz.
Leoni’s latest ParaLink variant represents a new milestone in the development of high-performance copper connections with low attenuation loss for broadband data transmission in computer centres. With optimised electrical properties, ParaLink 25s paves the way for such future data centre standards as QSFP-DD and OSFP at a transfer rate of 400 Gbit/s, more of which via copper. “25s” stands for 25 Gbit/s transfer per pair and an additional skin, i.e. a coating over each individual core pair.
A new pair design provides the breakthrough: while ParaLink 23 also already does reliably transfer 25 Gbit/s per data pair via copper, a skin extruded onto the individual core pairs further optimises the electrical transfer rates of ParaLink 25s. Thanks to this patented product design, the attenuation readings are improved by up to 20% compared with ParaLink 23.
APCT is a leading manufacturer of high reliability, rigid printed circuit boards. APCT provides a Broad Range of Technologies, including advanced & emerging HDI work, fabricated at superior turnaround times. Our 2 factory locations are in Santa Clara, California & Wallingford, Connecticut. We are set up to build proto-type runs and have the ability to manage production programs through our off-shore partnerships. The difference maker is our people. They give us the ability to say “Yes” to our customer’s demands of Technology & Lead Time. They work within the 3 pillars of our company: Passion, Commitment & Trust. Give us the opportunity to earn your trust and gain your loyalty.
Gigatest Labs probing systems are the industry standard for probing multiple-board-interconnects, BGAs, Test Sockets, Contactors, PCBs,and backplanes. We also offer customization of our probing systems to meet unique customer requirements.
SV Microwave is excited to launch our new line of high frequency solderless coaxial PCB edge launch connectors! These rugged and durable interconnects are adjustable to accommodate multiple PCB thicknesses and do not cause damage to the printed circuit board. Current interface configurations include our high frequency SMA, 2.92mm, 2.4mm and 1.85mm series. Additionally, these cost effective testing solutions are readily available through distribution. When precision and performance matters, connect with SV!
Sonnet Software maintains a single, dedicated focus on providing engineers all around the world with the capability and precision needed for their advanced circuit design. As the industry's leading high frequency electromagnetic (EM) software tool for planar circuit analysis, Sonnet utilizes the Shielded Domain Method of Moments technique to provide model extraction error frequently on the order of 1% or less. Sonnet offers high-accuracy analysis of predominantly planar (3D planar) circuits, interconnects in applications including RFIC, MMIC, and high density packaging applications, and handles kHz through THz frequencies. Sonnet’s most recent release, Sonnet Suites Release 16, features new integration with the Modelithics® CLR Library for Sonnet, speed increases in larger projects, and additional new features that give users more control and automation.
Harwin's SYCAMORE contact is a three-point SMT contact designed for high volume applications and, advanced automated assembly. This ultra-reliable and durable product offers superior pin retention for modules and devices subject to multiple insertions and removals. SYCAMORE contact is a single-part SMT socket design featuring a low profile of only 0.3mm max above the PCB. Available in top and bottom entry versions, it accepts 1mm or 1.5mm diameter pins and is open-ended, so mating depth is not limited. These contacts are suited for PCB layouts with field-replaceable modules with odd-form termination layouts. Temperature-sensitive components can also benefit from being assembled to the PCB via SYCAMORE Contacts. The SYCAMORE contact is ideal for sensor applications, such as domestic and commercial gas detection systems, fire alarms and metering systems.
Most of the part was idle
November 8-9, 2017