Samtec’s Edge Rate HD is a .635 mm pitch, multi-row interconnect system that provides an ultra-high density interface and next generation bandwidth.
The EDM6, EDF6 series has up to 240 total I/Os in a mere 1.88” square inches (12.1 square cm) of pcb real estate. This is possible because the interconnect’s four rows of pins, on .635 mm pitch, available in up to 60 pins per row, with a slim 5 mm wide insulator footprint. The mated stack height is a low 5 mm, with 7 mm and 10 mm stack heights to follow.
The system incorporates the Edge Rate® contact system, which is optimized for signal integrity performance. It is rated to 56 Gbps with PAM4 modulation.
Solder ball technology, for simplified processing, is standard, as are alignment pins and body polarization. The products are RoHS compliant and lead-free solderable.
These are the EDF6 and EDM6 series.