• Conference
    Jan 29–31, 2019
  • Expo
    Jan 30–31, 2019
  • Santa Clara Convention
    | Santa Clara, CA

ChipConnect internal faceplate-to-processor cable assemblies enable Intel® Omni-Path Architecture (OPA) by mating directly with Intel Xeon® Phi™ processors and Intel Xeon Scalable processors on the board and Internal Faceplate Transition (IFT) connectors at the faceplate. They provide 4x and 8x high speed data transmission lanes for 25 Gbps speeds. Straight and right-angle (left/right exit) Linear Edge Connector (LEC) cable plugs accommodate cable routing and the LEC receptacle is offered in A (LGA 3647 Socket P1) and B (LGA 3647 Socket P0) versions. These cable assemblies provide significantly better loss characteristics to reduce host board traces and PCB cost. We are one of two Intel qualified suppliers offering these first-generation cable assemblies (Intel OPA 100 Series) and TE is also a development partner for future generation Intel designs.