• Conference
    Jan 29–31, 2019
  • Expo
    Jan 30–31, 2019
  • Santa Clara Convention
    | Santa Clara, CA

FaradFlex® is Oak-Mitsui Technologies’ family of embedded capacitance materials. FaradFlex®, is a high performance ultra-thin laminate or resin coated copper material designed as an integral part of the PCB, module, MEMS, or chips package. It is typically used as copper clad dielectric layers in the PCB replacing other materials being use for power and ground layers. FaradFlex® uses Oak-Mitsui’s copper and resin technology for the broadest offering of ultra-thin laminates with the highest capacitance densities and Dk’s available in organic substrates.

By using FaradFlex® you can optimize signal and power integrity, minimize EMI, reduce surface mount passives and enhance PCB reliability. FaradFlex® is used in telecom, consumer electronics, avionics, military, and medical industries. Applications include PCBs, MEMS modules, RF modules, and chip packages.