Buda Leung, Sr. Technical Leader, Cadence Design Systems

Sean O'Kane, Marketing Director, Chip Planning Solutions Organization, ChipEstimate.com

Dima Smolyansky, Sampling Scope Marketing, Tektronix

Edson Ito, VectraŽ LCP Technical Marketing Manager, Ticona

Henrik Bremerskov, Director of Strategic Marketing, Actelis Networks

Carine Ziol, Head of IP Telephony Marketing, Comverse Netcentrex

Juergen Grabenhofer, Manager, Global Solution Sales, DSLAM, Nokia Siemens Networks

Bent Hessen-Schmidt, Vice President Business Development, SyntheSys Research Inc.

Robert Chandler, Senior Partner, CA Design

Dr. Herman Schmit, Technology Architect, eASIC

Barbara P. Aichinger, Future Plus Systems

Michael Schnecker, Product Specialist, LeCroy Corporation

Roman Boroditsky, Technology Director,NEL Frequency Controls, Inc.

Richard Pitwon, Senior Photonics Engineer, Xyratex Technologies Ltd.

Todd Westerhoff, Vice President, Software Products, SiSoft

Mario Larouche, Engineering Director, Synplicity

Eugene Mayevskiy, Applications Engineer, Tektronix, Inc.

Bent Hessen-Schmidt, Vice President, Business Development, SyntheSys Research, Inc.

Kevin Honan, Z-axis Product Manager, Cinch Connectors

Hecham Elkhatib, Engineering Manager, New Product Development, Cinch Connectors

David Lin, Vice President Product Marketing, Denali

Vivek Sardana, Product Marketing Manager, MIPS Technologies

Leo K. Wong, Product Marketing Manager, Rambus

Jim Nadolny, Samtec.

Peter Woo, Sr. Director of Product Marketing, eASIC

Adam Levinthal, Vice president of Customer Engineering, eASIC

Andreas Scheck, ERNI Electronics Inc.

Dana J. Bergey, Signal Integrity Manager, FCI USA, Inc.

Stephen B. Smith, Staff Signal Integrity Engineer, FCI USA, Inc.

Craig Rawlings, Director of Business Development, Kilopass

Julian Ferry, High Speed Engineering Manager, Samtec

Tom Waschura, SyntheSys Research, Inc

Bob Zeidman, Founder and President, Zeidman Technologies