Conference Chair

Misha Burich, Senior Vice President, Research and Development, Altera

PCB Summit Chair

George Dudnikov, Senior Vice President and Chief Technical Officer, PCB Division, Sanmina-SCI

IP Summit Chair

Yervant Zorian, Vice President and Chief Scientist, Virage Logic

Tariq Abou-Jeyab, Application Engineer, Sigrity
Maria Agoston, Principal Engineer, Tektronix
Rami Ahola, Principal Technical Manager, Mentor Graphics
Robert Aitken, Fellow, ARM
Ravinder Ajmani, Senior Engineer, Hitachi Global Storage Technologies
Tim Allen, Director, Altera
John Andresakis, Vice President, Strategic Tech., Oak-Mitsui Technologies
Michael Annand, Interconnect Technologist, Samtec
Tatsuya Arai, General Manager, High-Speed Interconnects, Hirose Electric
Bruce Archambeault, Distinguished Engineer, IBM
Brian Bailey, Principal, Brian Bailey Consulting
Ramesh Banda, Distinguished Member of Technical Staff, LSI Logic
Heidi Barnes, Senior Test Consultant, Verigy
Dana Bergey, Signal Integrity Manager, FCI
J.Bhasker, Architect, eSilicon Corporation
Ajay Bhatia, Senior Manager, Sun Microsystems
Tim Blackmore, Senior Staff Engineer, Infineon Technologies
Gustavo Blando, Principal Engineer, Sun Microsystems
Luis Boluña, Technical Leader, Cisco Systems
Brad Brim, Product Marketing Manager, Sigrity
David Brunker, Technical Fellow, Molex
Pierre Busson, System Architect, STMicroelectronics
Sergio Camerlo, Director, Engineering, Ericsson
Robert Carter, Sr. Business Development Manager, Oak-Mitsui Technologies
Federico Centola, EMC Technologist, Apple
Nitin Chawla, Member of Technical Staff, STMicroelectronics
Bill Chenv, Senior Engineering Manager, Cisco Systems
Jinhua Chen, Consulting Design Engineer, EMC Corporation
Raymond Y. Chen, Senior Vice President, Engineering, Sigrity
Xiaohe Chen, Signal Integrity Engineer, Apple
Wheling Cheng, Staff Engineer, Juniper Networks
Sam Chitwood, Field Application Engineer Manager, Sigrity
Chang Choo, Professor, San Jose State University
Antonio Ciccomancini Scogna, Senior Application Engineer, CST of America
Tom Cohen, Principal Development Engineer, Amphenol-TCS
John D'Ambrosiav, Ethernet Ecosystem Architect, Force10 Networks
Jim DeLap, Technical Services Manager, Ansoft Corporation
Olivier Despaux, Staff Strategic Applications Engineer, Xilinx
Jay Diepenbrock, Senior Technical Staff Member, IBM
David Dunham, Director, Molex
Greg Edlund, Senior Engineer, IBM
Mazlina Esa, Professor, Universiti Teknologi Malaysia
Jun Fan, Assistant Professor, Missouri University of Science & Technology
Saverio Fazzari, Associate, Booz Allen Hamilton
Tom Flaherty, Project Engineer, Corning Gilbert
Harry Foster, Chief Verification Scientist, Mentor Graphics
John Grebenkemper, Consultant, TALI Consulting
Xiaoxiong Gu, Research Staff Member, IBM
Sanjeev Gupta, Signal Integrity Applications Expert, Agilent Technologies
Robert Haller, Hardware Architect, Enterasys
Gert Havermann, Signal Integrity Engineer, HARTING Electronics
Amir Hekmatpour, Senior Engineer, IBM
Shankar Hemmady, Principal Engineer, Synopsys
Sachin Idgunji, Principal Engineer, ARM
Alfonso Iniguez, Principal Consultant, Total Verification
Vikram Jandhyala, Associate Professor, University of Washington
Isaac Kantorovich, Senior Hardware Engineer, Intel
Bhanu Kapoor, President, mimasic
Kumar Keshavan, Serial Channel Specialist, Sigrity
Sunil Khatri, Assistant Professor, Texas A&M University
Vikas Kohli, Architect, Front-End Tools, Cadence Design Systems
Ravi Kollipara, Senior Principal Engineer, Rambus
James Kruchowski, Senior Scientist, Mayo Clinic
An-Yu Kuo, Sigrity
Brock LaMeres, Assistant Professor, Montana State University
Mike Peng Li, Principal Architect, Altera
Feng Ling, Vice President, Engineering, Physware
Geping Liu, Member of Technical Staff, Altera
Christopher Loberg, Senior Manager, Tektronix
Om Mandhana, Senior R&D Engineer, Freescale Semiconductor
Henri Maramis, Technology Archtecture Manager, Intel
Mark Marlett, Senior Principal Engineer, Xilinx
Daniel Martin, Senior Application Engineer, Catalytic
Andrew Martwick, Analog Engineer, Intel
Sury Matur, Director, Design Automation, National Semiconductor
Steven McKinney, Technical Marketing Engineer, Mentor Graphics
Herve Menager, Engineering manager - Mixed Signal IP, Synopsys
Raghavan Menon, Director of Engineering, Virage Logic
Jason Miller, Staff Engineer, Sun MicroSystems
Martin Miller, Chief Scientist, LeCroy
Ozgur Misman, Substrate Co-Design Manager, Amkor Technology
Jitendra Mohanv, Engineering Manager, National Semiconductor
Bhyrav Mutnury, High-Speed Electrical Design Engineer, IBM
James Nadolny, Senior SI & EMI Engineer, Samtec
Alfred Neves, Senior Staff Engineer, Teraspeed Consulting
Khaled Nikro, Field Engineer, AWR
George Noh, Senior Member of Technical Staff, Vitesse Semiconductor
Istvan Novak, Distinguished Engineer, Sun Microsystems
Sean O'Boyle, Staff Engineering Manager, Qualcomm
Vishram Panditv, Power Integrity Engineer, Intel
John Plastererv, Manager, Mixed Signal Development, PMC-Sierra
Satish Premanathan, Principal Technical Consultant, Wipro
Peter Pupalaikis, Principal Technologist, LeCroy
David Quint, Master Engineer, Hewlett-Packard
Shafiq Rahman, Technical Staff Member, Hewlett-Packard
Suresh Rajgopal, Senior Principal Engineer, STMicroelectronicsv
Ranjeev Ranjan, Chief Technical Officer, Jasper Design Automation
Michael Resso, Business Development Manager, Agilent Technologiesv
Ilona Rolfes, Professor, Leibniz Universität Hannover
Gerardo Romov, Application Engineer, CST of America
Woong Hwan Ryu, Engineer Manager, Intel
Anthony Sanders, Senior Principal Engineer, Infineon Technologies
Aveek Sarkar, Vice President, Product Engineering, Apache Design Solutions
Martin Schauer, Principal Application Engineer, CST of America
Christian Schuster, Professor, Technical University Hamburg-Harburg
Hong Shi, Manager, Packaging Design Engineering, Altera
Kaijian Shi, Principal Consultant, Synopsys
Yuriy Shlepnev, President, Simberian
Leena Singh, Verification Architect, Rambus
Larry Smith, Principal Engineer, Altera
Dima Smolyansky, Director, Tektronix
Philippe Sochoux, H/W Engineer Manager, Cisco Systems
Michael Steinberger, Distinguished Member of Technical Staff, SiSoft
Ransom Stephens, Writer, Physicist, Public Speaker, Ransom's Notes
Suresh Subramaniam, Senior Staff Engineer, Tabula
Donald Telian, SI Consultant, SiGuys
Helene Thibieroz, Staff Support Engineer, Cadence Design Systems
Lars Thon, Consultant, LTE
Peter Tomaszewski, Principal Engineer, Signal Integrity, Ericsson
Ken Umino, Staff Consultant, Synopsys
Ambrish Varma, Senior Member of Technical Staff, Cadence Design Systems
Tanit Virutchapuntv, Power Integrity Specialist, Sigrity
Michael Vrazel, Technical Director, Quellan
Min Wang, Staff Analog Engineer, Intel
Qi Wang, Senior Architect, Cadence Design Systems
Ying Wei, Senior Member of Technical Staff, Orora Design Technologies
Kathy Werner, IP Strategy and Business Manager, Freescale Semiconductor
Todd Westerhoff, Vice President, Software Products, SiSoft
David Whipp, Senior Verification Engineer, NVIDIA
Larry Williams, Director of Business Development, Ansoft
Markus Witte, Signal Integrity Manager, HARTING Electronics
Xiaodong (Luke) Wu, Engineer, Texas Instruments
Chris Wyland, Manager, Signal Integrity Development, Xilinx
Qi Xiang, Manager, Technology, Altera
Zhiping Yang, Technical Lead, Cisco Systems
Mobashar Yazdani, Senior Engineer, Google
Ping Yeung, Product Manager, Mentor Graphics
Arch Zaliznyak, Manager, Design Engineering, Altera
Iliya Zamek, Consultant
Fabrizio Zanella, Support Manager, CST of America
Jared Zerbe, Director of Engineering, Rambus
Jianmin Zhang, Senior Signal Integrity Engineer, Cisco Systems
Jin Zhao, Hardware Engineer, Intel
Yu Zhu, Sr. Engineering Manager, Cadence Design Systems