FOR IMMEDIATE RELEASE

U.S. Contact: Katie Post
Phone: +1-312-559-3658
E-Mail: kpost@iec.org

CHICAGO – August 17, 2009 – The International Engineering Consortium today announced that submissions are invited for the DesignVision Awards which will be presented at the definitive event for electronic design, DesignCon 2010 this February 1–4 at the Santa Clara Convention Center.

The IEC's DesignVision Awards program offers a platform for companies to gain recognition for their most innovative products and successful design tools.

"We are pleased to award the companies and products that drive the production of electrical and semiconductor engineering with solutions for efficient and cost—effective market response," said IEC President John Janowiak. "The DesignVision program's commitment to innovation is supported by our esteemed panel of judges and all the participants that elevate the competition."

The deadline for entries for the DesignVision Awards is November 6, 2009. Finalist and winners will be chosen by members of the DesignCon Technical Program Committee, consisting of industry experts in the semiconductor and electronic design engineering community.

DesignVision awards will be presented in the following categories:

IC Design Tools

Design Verification Tools

Interconnect Technologies and Components

PCB Design Tools and Technologies

Semiconductor Components and ICs

Semiconductor IP

System Modeling and Simulation Tools

Test and Measurement Equipment

More information and entry forms can be found at www.designcon.com/2010/awards.

For additional information, visit www.designcon.com/2010 or contact Katie Post at kpost@iec.org or +1-312-559-3658.

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About DesignCon

Taking place annually in Silicon Valley, DesignCon serves as the premier event for practicing engineers in the electrical design and semiconductor communities. Broadening the scope to address business as well as technical issues in the industry, DesignCon historically hosts more than 120 exhibiting companies and draws more than 5,000 industry professionals to register. DesignCon 2010 will welcome back the IP Summit as well as premiere the PCB Summit as special featured programs of the conference and exhibition. Visit www.designcon.com/2010.

About the IEC
A nonprofit organization, the IEC is dedicated to catalyzing technology and business progress worldwide in a range of high—technology industries and their university communities. Since 1944, the IEC has provided high—quality educational opportunities for industry professionals, academics, and students.

In conjunction with industry—leading companies, the IEC has developed an extensive, free, on—line educational program. The IEC conducts industry-university programs that have substantial impact on curricula. It also conducts research and develops publications, conferences, and technological exhibits that address major opportunities and challenges of the information age.

More than 70 leading high—technology universities are IEC affiliates, and the IEC handles the affairs of the Electrical and Computer Engineering Department Heads Association and Eta Kappa Nu, the honor society for electrical and computer engineers. Please visit www.iec.org