FOR IMMEDIATE RELEASE

U.S. Contact: Katie Post
Phone: +1-312-559-3658
E-Mail: kpost@iec.org

The International Engineering Consortium will name the industry's best at the DesignVision Awards ceremony during DesignCon 2010 next month

CHICAGO – January 11, 2010 – The International Engineering Consortium today announced the finalists of its 2010 DesignVision Awards program naming the design tools and products judged as the most unique and beneficial to the semiconductor industry.

The finalists were selected by the DesignCon 2010 Technical Program Committee, consisting of industry experts in the semiconductor and electronic design engineering community. The IEC will announce winners on Tuesday, February 2 at 11:50am in the Main Theater.

"We are very proud to honor the work of individuals and companies who have shown outstanding commitment to advancing the electronic design and semiconductor industry with the DesignVision Awards," stated IEC President John R. Janowiak. "We also thank the members of the Technical Program Committee for judging the exceptional submissions received this year."

The 2010 award finalists include the following companies and products in each of the eight categories respectively:

IC Design Tools

• Cadence Design Systems for the Encounter Digital Implementation System
• Altera Corporation for the Quartus II Software version 9.1
• Xilinx for the Xilinx ISE Design Suite 11

Design Verification Tools

• Agilent Technologies for the ADS DDR3 Compliance Design Kit
• DFT Microsystems for the DV1600 SerDes Validation Tester
• Synopsys for the VCS 2009.09

Interconnect Technologies and Components

• Samtec for BullsEye^TM
• Molex Incorporated for the EdgeLine CoEdge Connector
• FCI for the High Performance High Density TwinMezz^TM

PCB Design Tools and Technologies

• Altium Limited for the Altium Designer
• Rogers Corporation for the RO4000® LoPro^TM Series Laminate
• Simberian Inc. for the Simbeor 2008.01

Semiconductor Components and ICs

• PMC-Sierra for the HyPHY 10G & 20G
• Maxim Integrated Products for the MAX2078
• SiBEAM for SiBEAM's Second-Generation SB9220/SB9

Semiconductor IP

• Cadence Design Systems for the Chipestimate.com Semiconductor IP Customer Testimonials
• Coreworks for the CWda60 - Sideworks Dolby Digital Professional Encoder IP
• Rambus for the Rambus and Kingston Threaded Module

System Modeling and Simulation Tools

• Sigrity for the Channel Designer
• Mentor Graphics for the HyperLynx PI
• E-System Design for SPHINX

Test and Measurement Equipment

• Agilent Technologies for the Agilent J-BERT N4903B
• SyntheSys Research for the BERTScope Si 25000C & BERTScope CR 25000A
• LeCroy Corporation for the WaveMaster 830Zi

DesignVision Awards are judged according to the following criteria:

• Innovation
• Uniqueness
• Market Impact
• Customer Benefits
• Value to the Industry

Visit DesignCon 2010 for full information or contact Katie Post at kpost@iec.org or +1-312-559-3658.

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About DesignCon

Taking place annually in Silicon Valley, DesignCon serves as the premier event for practicing engineers in the electrical design and semiconductor communities. Broadening the scope to address business as well as technical issues in the industry, DesignCon historically hosts more than 120 exhibiting companies and draws more than 5,000 industry professionals to register. DesignCon 2010 will welcome back the IP Summit as well as premiere the PCB Summit as special featured programs of the conference and exhibition. Visit www.designcon.com/2010.

About the IEC
A nonprofit organization, the IEC is dedicated to catalyzing technology and business progress worldwide in a range of high—technology industries and their university communities. Since 1944, the IEC has provided high—quality educational opportunities for industry professionals, academics, and students.

In conjunction with industry—leading companies, the IEC has developed an extensive, free, on—line educational program. The IEC conducts industry-university programs that have substantial impact on curricula. It also conducts research and develops publications, conferences, and technological exhibits that address major opportunities and challenges of the information age.

More than 70 leading high—technology universities are IEC affiliates, and the IEC handles the affairs of the Electrical and Computer Engineering Department Heads Association and Eta Kappa Nu, the honor society for electrical and computer engineers. Please visit www.iec.org