Chairperson:

Istvan Novak
Distinguished Engineer, SPARC Volume Servers
Sun Microsystems

Dr. Novak is Distinguished Engineer, signal and power integrity, at SUN Microsystems, Inc.

In addition to signal-integrity system design of high-speed serial and parallel buses, he is engaged in the methodologies, designs and characterization of power-distribution networks and packages for workgroup servers. Dr. Novak has 30+ years of experience with high-speed digital, RF, and analog circuit and system design and has twenty five patents. He is Fellow of IEEE for his contributions to the signal-integrity and RF measurement and simulation methodologies.

Speakers:

Don DeGroot
President & Lead Consultant
CCNi

Dr. Don DeGroot is President of CCNi, a test and measurement business supporting high-speed electronic design. Don has 25 years experience in high-frequency measurements and design with industry, government, and academia. He currently focuses on services that add high value to design and manufacturing, including multiport TDR and S-parameter measurements, dielectric characterization, and component qualification. Don's work includes over 100 publications and presentations that have been recognized with the U.S. Department of Commerce Silver Medal and society awards.

Allen F. Horn
Associate Research Fellow
Rogers Corp.

Dr. Horn, III received a BSChE from Syracuse University in 1979, and a Ph. D. in chemical engineering from M.I.T. in 1984. Prior to joining the Rogers Corporation Luire R&D Center in 1987, he worked for Dow Corning and ARCO Chemical. He is an inventor/co-inventor on 15 issued US patents in the area of ceramic or mineral powder-filled polymer composites for electronic applications.

Roger Krabbenhoft
IBM

Mr. Krabbenhoft received a BS degree in Electrical and Electronics Engineering from North Dakota State University in 1991, after which he joined IBM's Storage Division in Rochester, MN. He spent the first 9 years of his career at IBM focusing on various aspects of HDD actuator flex cable design/development, test, and failure analysis. In 2000, he transferred to IBM's Systems and Technology Group where he led a team of engineers responsible for the development and qualification of printed circuit board technologies for IBM's server family. His recent work is in the area of high speed printed circuit board solutions for next generation server applications.

Tony Senese
OEM Business Development Manager
Panasonic Electric Works

Mr. Senese is OEM Business Development Manager for Panasonic Electric Works R&M Group. He was formerly the Vice President of Taconic-TCL in La Verne, CA. Mr. Senese started with the Mica Corporation as an engineering technician in 1979 and has worked in various engineering, quality, manufacturing, management, and marketing functions in the industry over the last 30 years. He is the current Chair of the IPC 3-11 subcommittee overseeing the IPC-4101 specification. In 2006 and 2009 he received IPC Distinguished Service Awards for his work on the B-revision and the C-revision of that document. Mr. Senese has published numerous technical papers and instructed the IPC Professional Advancement Course on Substrate materials.