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VERSION:2.0
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CLASS:PUBLIC
PRIORITY:3
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UID:1012010302
SUMMARY:DesignCon 2010 - TF-TH1 | Practical Methodologies for Power/Signal Integrity of Chip-Package-Board Designs 
LOCATION:Santa Clara Convention Center, Santa Clara, California 
DTSTART:20100203T150000Z
DTEND:20100203T180000Z
DTSTAMP:20100203T151034Z
DESCRIPTION: Chip, package and board designs cannot happen in isolation given performance and cost considerations. An analysis and verification methodology that targets power delivery and signal integrity in a co-design framework is required to ensure that the system performance specifications are met at the lowest design and material costs. For example, for power delivery network design, an analysis environment that accurately models the chip, package and board and allows for multiple analyses (DC, AC and transient) concurrently is required. Similarly, for signal integrity especially for high speed IO interfaces, the simultaneous consideration of the IO ring design, IO and decoupling capacitor cell placement, input switching pattern, and package/board power and signal layouts is necessary. 
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