DesignCon 2010DesignCon 2010
DesignCon 2010
DesignCon 2010Program Schedule
TF-MP3 | Tutorial
Active Cable Interconnects for High-Speed Serial Communications
Monday, February 1 | 1:30 pm - 4:30 pm

Gourgen Oganessyan, Staff Product Marketing Engineer, Staff Product Marketing Enginee, Intersil Corp.

Active direct-attach cables are emerging as a popular alternative to passive copper cables and optical transceivers. They offer greater reach and thinner gauge than passive cables, pushing out the point at which optical transceivers are required. This leads to cost and power savings and improved cable management.

Several industry standards have recognized the value of active cables and are updating their specifications to enable support for these interconnects.

This tutorial gives an overview of active cable technology and discusses copper and optical cable designs. An overview of active cable provisions in various high-speed communications standards is given including typical performance.

DesignCon 2010
DC 2010 Program
Preview the event program guide
DC 2010 Program
View the Exhibitor Product Guide
FEATURED EVENTS
IEC IEC
OFFICIAL HOST SPONSOR
Agilent Technologies
IP SUMMIT SPONSOR
ChipEstimate.com
CORPORATE PARTNER
Rambus
DIAMOND SPONSORS
LeCroy
LeCroy
GOLD SPONSORS
Mentor Graphics
SILVER SPONSORS
SILVER SPONSORS MoSys
CORPORATE REGISTRATION SPONSORS
Altera
Cisco
Ericsson
National Semiconductor
Sun Microsystems
Xilinx
DesignCon - Sponsors

In00foVault Sponsor SiSo

CHIPHEAD'S SOCIAL NETWORKS
DesignCon 2010