Heidi Barnes, Senior Engineer, Semiconductor Test Systems, Verigy
Yuriy Shlepnev, President, Simberian Inc.
Jim Nadolny, Signal Integrity Specialist, Samtec
Scott McMorrow, President, Teraspeed Consulting Group
Tom Dagostino, Vice President, Teraspeed Consulting Group

The purpose of this tutorial is to provide the attendees with practical examples and a toolbox of techniques for measuring and modeling the Signal Integrity of high speed interconnects. It may seem only a small step from 3 Gbps to 10Gbps but in terms of measurement quality and simulations this is where the real work begins and it is no longer just a few that face this challenge. Mainstream PCIE and HyperTransport interfaces are moving beyond 5Gbps, DDR memory is pushing past 3Gbps, and XDR is pushing 10 Gbps. The tutorial will focus on bringing together connector design examples along with the basics in theory and methodology to provide a solid understanding of the quality of measurements and simulations at high speeds.