Neoconix has developed a revolutionary new approach to connector design & manufacturing that utilizes advanced printed circuit board (PCB) processing techniques to produce high density connectors. Leveraging photolithographic processes, Neoconix's PCBeam^TM technology enables industry leading design versatility and dimensional scalability. Example capabilities include sub-0.75mm array pitch, 0.4mm row pitch, sub-0.5mm mated thickness, multi-layer options, and pincounts greater than 5,000. Neoconix products are used in flex-to-board, LGA device-to-board, and board-to-board applications.

Technologies on Display:

Neoconix PCBeam Interposers and Sockets
Product Category: Interconnect Technologies and Components

Neoconix's PCBeam^TM technology is an innovative new approach to designing and manufacturing electrical connectors. In contrast to traditional molding & stitching of metal contacts, Neoconix uses photolithography and etch processes to produce its connector products. Inherent with this PCB-style approach is tremendous design versatility and a wealth of new capabilities. Neoconix can address standard as well as very custom contact layouts, and currently offers products with array pitches to <0.75mm and row pitches to <0.4mm. Neoconix achieves this scalability while maintaining the advantages of a mechanically and electrically robust, all-metal spring structure. PCBeam^TM interposers can be used for board-to-board, LGA device-to-board, and flex-to-board applications.

Low Profile LGA1366 Sockets
Product Category: Interconnect Technologies and Components

Neoconix now offers the lowest profile sockets in the industry for Intel LGA1366 microprocessor products. This new socket product has a seating plane that is 2mm lower than traditional sockets, enabling a larger heat sink, better airflow, and up to 20W of additional power dissipation. Better SI performance is also achieved through a shorter signal path. Neoconix low-profile sockets are also available in other industry standard LGA configurations.