DesignCon 2010DesignCon 2010
DesignCon 2010
DesignCon 2010Exhibitor List - MoSys, Inc.

DesignCon 2010 - MoSys

Booth #422

www.mosys.com

MoSys® develops, markets and licenses differentiated embedded memory IP and high speed parallel and serial interface IP for advanced SoC designs.

MoSys' patented 1T-SRAM® and 1T-Flash® memory technologies offer a combination of high density, low power consumption, high speed and low cost advantages that are unmatched by other available memory technologies for a variety of networking, computing, storage and consumer/graphics applications.

MoSys' silicon-proven interface IP portfolio includes DDR3/2 Combo PHYs, as well as SerDes IP that support data rates from 1 Gigabit per second (Gbps) to 11Gbps, across a wide range of standards, including PCI-Express, XAUI, SATA, USB and 10G KR.

MoSys IP has been production-proven in more than 190 million devices.

Technologies on Display:

MoSys SerDes IP
Product Category: Semiconductor IP

MoSys' silicon proven PHYs support a wide range of protocols ranging from 1.25Gbps to 11.3Gbps. Chip designers get access to risk-free silicon-proven PHYs at advanced process nodes.

MoSys offers a broad portfolio of silicon-proven PHYs across a wide range of protocols and process nodes.

MoSys DDR3 PHY
Product Category: Semiconductor IP

MoSys' silicon proven DDR3 PHYs support a wide range of data-rates from 533Mbps to 2133Mbps. Chip designers obtain access to risk-free silicon-proven hardened PHY macros at advanced process nodes.

MoSys' DDR3 PHYs are JEDEC compliant and DFI 2.1 compliant. The PHY is a complete hardened macro requiring no additional IP components. It delivers seamless interoperability with industry standard controllers.

1T-SRAM
Product Category: Semiconductor IP

Differentiated, patented memory technology with an unparalleled combination of performance, density, low power and cost. 1T-SRAM combines the high capacity of embedded DRAM (eDRAM) with the performance, low power and ease of manufacture of traditional (6T) SRAM. 1T-SRAM has been used successfully in over 175 million devices powering dozens of market-leading electronic products.

Special Booth Activities:

Visit booth #422 for a live demonstration of our high-speed SerDes solution, and learn more about MoSys' differentiated high-speed interface IP and high-density memory IP for systems-on-chips.

DesignCon 2010
DC 2010 Program
Preview the event program guide
DC 2010 Program
View the Exhibitor Product Guide
FEATURED EVENTS
IEC IEC
OFFICIAL HOST SPONSOR
Agilent Technologies
IP SUMMIT SPONSOR
ChipEstimate.com
CORPORATE PARTNER
Rambus
DIAMOND SPONSORS
LeCroy
LeCroy
GOLD SPONSORS
Mentor Graphics
SILVER SPONSORS
SILVER SPONSORS MoSys
CORPORATE REGISTRATION SPONSORS
Altera
Cisco
Ericsson
National Semiconductor
Sun Microsystems
Xilinx
DesignCon - Sponsors
SPONSORED BY
IEC

CONTACT:

CHRISTINE PAPLACZYK
Exhibit Sales Director

Phone: +1-312-559-4616
E-mail: cpaplaczyk@iec.org

In00foVault Sponsor SiSo

CHIPHEAD'S SOCIAL NETWORKS
DesignCon 2010