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DesignCon 2010Exhibitor List - Molex

DesignCon 2010  - Molex

Booth #509

www.molex.com

As a leading supplier of interconnect solutions, Molex is focused on designing and developing innovative solutions critical to high-speed, high-density, high-signal integrity applications. Our portfolio is among the world's largest with over 100,000 products, including everything from electrical and fiber optic interconnect solutions to switches and application tooling. Molex serves customers in a variety of industries, including the datacom, telecom, computer/ peripheral, automotive, industrial, consumer, medical and military markets. Visit Molex at www.molex.com.

Technologies on Display:

Molex iPass+TM High Density (HD) Connector
Product Category: Interconnect Technologies and Components

Molex's iPass+TM High Density (HD) system is a low-profile system that provides multi-plugging capability of 8x and 4x cables to a common host board receptacle options. The iPass+ HD external input/output (I/O) connector includes eight sideband signals per 4x port. These additional signals enable cable management functions for passive and active copper , as well as active copper cables and pluggable modules for extended-length applications in data centers. The new pinouts for iPass+ HD map readily to existing legacy products. The reduced size of the iPass+ HD system provides additional real estate and beach front for system designers. The iPass+ HD I/O is capable of transmitting double the data rate of the current 6 Gbps specification, enabling connector consolidation at SAS Gen 3.

CoEdge Connector EdgeLineTM
Product Category: Interconnect Technologies and Components

The one-piece EdgeLineTM 12.5 Gbps CoEdge Connector is designed to meet the demands of high-speed signal transmissions and high-density requirements. It is configured to meet an industry standard pitch of 0.80mm. This low-profile, dual-sided, edge-card connector can mate two PCB edgecards with different PCB thicknesses on a common plane and accommodates a low profile off of the board for improved airflow in system cooling environments. The versatile EdgeLine CoEdge Connector supports sixteen PCB thickness variations with multiple circuit sizes and keying options included. CoEdge Connectors ensure PCBs are aligned at the centerline to allow for a uniform signal path across the length of the connector to offer high-speed differential performance up to 15 Gbps and 1.5A of power per pin.

ImpactTM Coplanar Connector System

The ImpactTM Coplanar Connector System from Molex pushes the speed and density envelope to meet the growing demands of next-generation telecommunication and data networking equipment; the system is available in 2- 3, 4, & 6-pair configurations with a complete range of guidance and power-solution options

The Impact coplanar connector system provides data rates over 25 Gbps and superior signal density up to 80 differential pairs per inch. The Impact system's broad-edge-coupled transmission technology enables low cross talk and high signal bandwidth while minimizing channel-performance variation across every differential pair within the system.

Molex's Impact coplanar system is available in multiple compliant-pin design options on both right angle male and right angel female connectors, providing customers ultimate flexibility to optimize their designs for superior mechanical and electrical performance. The Impact system's mating interface provides in-line staggered, bifurcated contacts that provide 2 points of contact for long-term reliability performance and built-in, ground-signal sequencing. This reduces the average mating force per connector to improve the mechanical mating performance of the system.

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CONTACT:

CHRISTINE PAPLACZYK
Exhibit Sales Director

Phone: +1-312-559-4616
E-mail: cpaplaczyk@iec.org

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