Ironwood Electronics is ISO9001/2000 certified and offers a wide selection of high performance adapters and sockets, plus experienced engineering for quick-turn customs. We offer probing, prototype, and SMT package emulation for all SMT packages. High-bandwidth 40 GHz sockets for BGA/QFN pitches to 0.3 mm, only 2.5 mm larger than IC. Latest adapters include QFN/MLF package emulators, BGA high endurance test sockets, BGA production adapters, and back-to-back Xilinx-compatible BGA sockets. Our adapters/sockets support the product life cycle. In the design cycle, engineers are able to test and develop products more quickly with Ironwood prototype and test adapters for all package type-along with the very high density 40 GHz BGA and QFN/MLF sockets. In production, Ironwood can help extend the product life of PCBs, using our package converter technology to replace or upgrade original or obsolete components and provide small to high volume turn-key solutions.

Technologies on Display:

Stamped spring pin socket
Product Category: Interconnect Technologies and Components

Ironwood Electronics recently introduced a new socket product line addressing high performance requirements for Burn-in and Test applications - SBT-BGA-7003. The contactor is a stamped spring pin with 26 gram actuation force per ball and cycle life of 100,000 insertions. The self inductance of the contactor is 0.88 nH, insertion loss of < 1 dB at 20 GHz and capacitance 0.097pF. The current capacity of each contactor is 4 amps at 80C temperature rise. Socket temperature range is -55C to +180C. Socket also features a floating guide for precise ball to pin alignment. The specific configuration of the package to be tested in the SBT-BGA-7003 is BGA, 8x8mm body size, 0.5mm pitch and 14x14 ball array. To use, drop IC into the socket, place floating compression plate, swivel the lid, and apply down force using compression screw. This socket can be used for hand test and quick turn custom burn-in applications with the most stringent requirements.

Size 0.5mm Pitch BGA Giga-snaP^TM Adapter
Product Category: Interconnect Technologies and Components

Ironwood Electronics' new high performance socket - SFS-BGA104A-52 allows 0.5mm pitch, 8x8mm body, and 15X15 array BGA devices to be socketed and operate without compromising performance in demanding automotive applications. The Giga-snaP^TM BGA SMT adapter pair consists of SFS-BGA104A-52, patent pending female sockets with machined pins and sleeve spring into an assembly that matches the male pin LSS-BGA104A-51. The RoHS compliant SFS-BGA104A-52 is soldered to a PCB using standard RoHS soldering methods. Both adapters are constructed with high temperature Torlon 5530 material assuring match with target PCB's and preventing failures that occur with CTE mismatch. LSS-BGA104A-51 BGA adapter, to which the user attaches a target 104 ball BGA chip, is plugged into the female socket on the board, thereby chip is interconnected and the system is ready to go. The Giga-snaP BGA Surface Mount Feet Adapters require low force than the conventional adapters at 40g per pin for easy plugging and removing operation. The electrical path of the Giga-snaP^TM BGA SMT adapters is a high priority performance issue with the physical length from the top connection point on the male adapter to the bottom tip on the female socket is 2.8 mm. This is the shortest connection length by far for machined pin sockets, therefore providing better transmission of high frequency signals. These adapters passed environmental tests (MIL-STD) and qualified for automotive applications. The 0.5mm Giga-snaP^TM BGA SMT Adapter line is available in many different pin counts and customs can be delivered in days.

High bandwidth elastomer socket
Product Category: Interconnect Technologies and Components

Ironwood Electronics has recently introduced the new high performance BGA socket for 1.0mm pitch BGA. The SG-BGA-8019 socket is designed for a 35mm package size; operate at bandwidth up to 10 GHz with less than 1dB of insertion loss. The sockets are designed to dissipate 16 watts with swivel heat sink lid. The swivel heat sink lid swivels over the shoulder screw which is fixed in the socket body. The contact resistance is typically 20 milliohms per pin. The SG-BGA-8019 is constructed with high performance and low inductance elastomer. The temperature range is -40 C to +100 C. The pin inductance is 0.15 nH. Capacitance to ground is 0.10 pF. Current capacity is 2A per pin. The socket accommodates IC packages such as the IDT 35x35mm, 1mm pitch FCBGA. Simply attach the socket to the PCB, drop in chip, place and tighten easy install swivel lid with heat sink. This elastomer socket technology, applicable for BGA pitches from 0.3 to 1.27mm, allows these pitch BGAÕs to operate to over 10 GHz without significant contactor loss.