ISI specializes in microelectronic modules, advanced IC packaging and interconnect solutions including High Performance Computing (HPC) Modules, 3D Over-Molded Modules, High Density 3D Memory Packaging and FPGA Systems design. ISI holds 29 patents for products and designs. Our broad capabilities include: high density PCB Design, fine pitch SMT, Flip Chip, Wirebond Assembly and design-in packaging. ISI's broad capabilities and fast-track process development provide a superior level of integration for System Designers at an unprecedented speed-to-market.