Hirose Electric Co., LTD. is a worldwide technology leader specializing in high-speed mezzanine connection systems, along with electronic, RF and fiber connectors. Hirose is continually developing both innovative and cost effective BGA and SMT interconnect systems that will stretch performance beyond 20G. Please visit www.Hirose.com to see our full offering of Creative Links to World Electronics.

Technologies on Display:

IT3
Product Category: Interconnect Technologies and Components

The IT3 BGA mezzanine connector system from Hirose provides a truly reliable 10+ Gb/s board-to-board interface. With its unique three-piece design, IT3 provides unmatched mounting and BGA reliability without sacrificing signal integrity. With stack heights ranging from 10-40mm, a signal density of 73 differential pairs per linear inch, and either 85 or 100ohm differential impedance, IT3 is the standard for flexibility for any application.

XG1
Product Category: Interconnect Technologies and Components

The XG1 mezzanine connector system from Hirose provides 10+ Gb/s performance in a reliable and cost effective 0.5mm pitch 2-row SMT package. XG1 has the flexibility of pin counts ranging from 52 to 260 position, stack heights from 15mm to 38mm, and is available in either 85 or 100 differential impedance.

Special Booth Activities:

Signal Integrity demonstrations on IT3 and XG1.