Helic provides Electronic Design Automation (EDA) software tools and semiconductor intellectually property (IP), with a mission to enable increased levels of miniaturization for semiconductor-based wireless and broadband systems.

We are a world leading provider of rapid electromagnetics and RF silicon synthesis and verification technologies.

In more than a decade of service to leading semiconductor companies, we are revolutionizing the way ICs and modules are being designed, verified, and manufactured.

Technologies on Display:

VeloceRF
Product Category: IC Design Tools

VeloceRF is a powerful EDA tool bringing for the first time rapid modeling and synthesis of integrated inductors and transformers, with signoff accuracy for electromagnetic effects such as spiral-to-spiral mutual inductance, skin effect and substrate losses.

VeloceRF is the only tool of its kind with out-of-the-box support for DRC- and DFM-clean spiral inductors in a variety of nanoscale CMOS (90/65/45 nm) PDKs.

VeloceRaptor/X
Product Category: IC Design Tools

VeloceRaptor/X is a breakthrough RLCK extraction tool with unparalleled capacity and speed in the modeling of integrated passives such as transmission lines, interconnects, digital high-speed lines, spiral inductors and metal-insulator-metal (MIM) capacitors.

The tool is powered by Helic's renowned vector-based inductance modeling engine (VeloceRaptor^TM) which guarantees rapid EM model generation with no compromises in accuracy. As a layout extraction tool, VeloceRaptor/X contends and outperforms conventional EM simulators in terms of speed vs. accuracy.

VeloceRaptor/X can be combined with Helic's VeloceRF^TM toolset to provide - for the first time - a complete solution for spiral inductor synthesis and wholechip modeling of RFICs and Systems-in-Package.

VeloceWired
Product Category: IC Design Tools

VeloceWired® is a powerful package design tool providing rapid bondwire creation and extraction. With VeloceWired® bondwire design becomes an integral part of the IC tool flow. Featuring a rapid modeler that allows full RLCK extraction of bondwire interconnects in mere seconds, VeloceWired® enables the co-design of high-speed circuitry with the package and bridges the related gap in parasitics sign-off. VeloceWired® gives the IC designer control over the package, and helps you reach an optimal design down to the pin.