DuPont Circuit & Packaging Materials, part of DuPont Electronics, will highlight its latest material innovations at DesignCon 2010, including its expanded portfolio of leading Pyralux® AP brand flexible circuit materials which offer a new range of options for high reliability designs. DuPont is also introducing its newest flexible circuit material offering, Pyralux® TK, which incorporates Teflon® technology to meet today's demands for thin, flexible high speed applications.