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Apache is a leading provider of power and noise solutions for chip-package-system convergence from RTL to sign-off. Apache's products address challenges unique to specific design domains including digital, analog/mixed-signal, package/PCB, and SiP, while providing an eco-platform integrating SoC, custom IP, and System worlds. From RTL power reduction and early stage prototyping, through chip and package sign-off, Apache's products address critical power and noise challenges and enable designers to reduce cost, mitigate risk, and improve time-to-market.

Practical Methodologies for Power/Signal Integrity of Chip-Package-Board Designs
This workshop will discuss the chip-package-board analysis methods for both power and signal integrity in terms of modeling, extraction and simulation technologies. Representatives from key semiconductor and system design companies will share their insights into these techniques and will also participate in a panel discussion on the requirements for die modeling.

Technologies on Display:

Sentinel
Product Category: PCB Design Tools and Technologies

Sentinel is a complete Chip-Package-System (CPS) co-design/co-analysis solution addressing system-level power integrity, I/O-SSO, thermal, and EMI challenges. It combines chip's core switching power delivery network (PDN), I/O sub-system, and package / PCB models and analysis in a single environment for accurate chip-package-system co-design from early stage prototyping to signoff.

At the core of Sentinel is Chip Power Model (CPM), a compact spice compatible model of the full-chip PDN. During early stage prototyping, CPM enables designers to optimize package layers, power pads, and decaps, resulting in cost effective package designs. With CPM, designers gain higher degree of confidence in their package signoff by considering the impact of chip's PDN on their package designs.

Totem
Product Category: IC Design Tools

Totem is the industry's first full-chip noise integrity platform for analog and mixed-signal designs. It addresses the challenges associated with global couplings of power/ground noise, substrate noise, and package/PCB capacitive and inductive noise for analog, mixed-signal, memory, and high-speed I/O designs. Totem considers the impact of full-chip SoC substrate noise by directly interfacing with RedHawk to obtain accurate substrate injection signature for all digital components. Totem accurately analyzes noise coupling effects at every time-point using a single kernel solver, enabling designers to account for all global noise impact on their design.

RedHawk
Product Category: IC Design Tools

RedHawk-NX is a next generation dynamic power integrity solution re-architected to handle designs of more than five hundred million gates, while maintaining sign-off accuracy. RedHawk accurately analyzes the effects of simultaneous switching noise (core, memory, I/O), decoupling capacitance (intentional and intrinsic), and on-chip and off-chip (package) inductance. It enables designers to analyze the impact of dynamic voltage drop on timing and jitter (PSI), explore and identify physical design weaknesses (RHE), automatically repair source of supply noise (FAO), and verify power and signal EM (SEM).

RedHawk has been certified by TSMC and Common Platform Reference Flows, and is silicon proven with thousands of successful tape-outs by leading IDM and fabless semiconductor companies.

Special Booth Activities:

Apache will be demonstrating industry leading chip-package-system convergence solutions in booth #416. The demonstration will focus on power and signal integrity analysis and optimization for IC package, SiP, and PCB designs. Apache will also be presenting the creation and use of application specific die models such as CPM for IC-package PI, SI, EMI, and thermal co-design/co-analysis.