Ansoft, a subsidiary of ANSYS, Inc., will display its simulation driven product development process for advanced packaging (SiP, stacked package, PoP, SOC) and complex PCB design. Ansoft's simulation software provides an end-to-end solution that enables designers to perform EMI, signal, and power integrity analysis. In addition, we will demonstrate our new software solutions for PCB and system level thermal management, acoustic analysis, vibration and drop test analysis.