While debate rages over when Moore's Law hits a technology wall, a few enterprising technologists have moved beyond debate and are looking at stacked die or 3–D packaging as the path to future functionality. And while stacked die technology has proven feasible, it may be the business aspects of bringing this paradigm to fruition that prove the most challenging.

Stacked die, or 3–D device technology is the processes of integrating up to three die within a single semiconductor package. Such an approach makes it possible to mix and match lithographic geometries. But the question arises: Who is going to put it all together so that all parties in the supply chain can make money? The panel will address strategic questions like: What pieces are missing for critical success? Who will benefit the most from the 3–D approach? And if the companies who will benefit the most are not paying for the required research, who will pay and what is in it for them?

Chairperson:

Ed Sperling
Editor–in–Chief
System–Level Design

Speakers:

Javier DeLaCruz
Semiconductor Packaging Director
eSilicon Corporation

Mr. DeLaCruz is the Semiconductor Packaging Director at eSilicon Corporation. He is responsible for all package engineering activities including design, package selection, electrical extraction and simulation, co-design activities with the physical design teams as well as system level integration.

Mr. DeLaCruz has over 12 years of experience in semiconductor packaging and is a senior member of IEEE. He has extensive knowledge in analog design, high-speed digital design, thermal and electrical simulation, and package assembly.

Rajiv Maheshwary
Senior Director, Customer Marketing
Synopsys

Mr. Maheshwary is senior director at Synopsys, responsible for customer marketing and strategic initiatives. He has over 25 years of IC design and EDA product and strategic marketing experience. He holds a B.S.E.E. from Worcester Polytechnic Institute, an MBA in marketing from Lucas Graduate School of Business at San Jose State University, and a Japanese Language Business Proficiency Certificate from Berlitz and the Japan Foundation. Mr. Maheshwary is an honorary member of Continental Who's Who registry of professionals and executives.

Carey Robertson
Director of Product Marketing
Mentor Graphics

Mr. Robertson is a director of product marketing at Mentor Graphics overseeing the marketing activities for layout versus schematic (LVS) and extraction products. He has been with Mentor Graphics for nine years in various product and technical marketing roles. Prior to Mentor Graphics, Mr. Robertson was a design engineer at Digital Equipment Corp., working on microprocessor design. He holds a BS from Stanford University and an MS from UC Berkeley.

Glenn Daves
Director of Packaging Solutions Development
Freescale Semiconductor, Inc.

Mr. Daves is responsible for research, development, and design of Freescale's semiconductor packaging product and technology portfolio. This portfolio spans the range from low pin count molded wirebond packages, to high pin count flip chip, to specialty MEMS sensor and analog power packages. Prior to Freescale, he worked for the IBM Corporation where, in his most recent position, he led IBM's global packaging product and technology development. While in this role, he launched IBM's 3D-TSV development program. Mr. Daves has also held leadership positions in project management, test and burn-in engineering, and assembly manufacturing engineering. He holds seventeen U.S. patents and has degrees from Brown University, the University of Illinois at Urbana-Champaign, and Alliance Theological Seminary.