DesignCon 2010DesignCon 2010
DesignCon 2010
DesignCon 2010Program Schedule
7-TA4
Simulation Techniques for 6+ Gbps Serial Links
Tuesday, February 2 | 11:00 am – 11:40 am

Donald Telian, SI Consultant, SIguys
Sergio Camerlo, Engineering Director, Ericsson
Brian Kirk, SI Engineer, Amphenol-TCS

This paper details a thorough process for serial link SI analysis in the 6+ Gbps range - from modeling to measurement. Proper modeling techniques for both the active (SerDes, AMI, transistor-level, etc) and passive (3D extraction, S-parameters, parasitics, etc) devices are described, along with solutions for making progress when desired models are not available. Sensitivity analysis reveals variables that limit system performance and guides design choices to optimize the link - adding as much as 50% more system margin. With variables and tolerances understood, thorough worst-case analysis is performed to quantify anticipated design margin which is later confirmed through measurement.

DesignCon 2010
DC 2010 Program
Preview the event program guide
DC 2010 Program
View the Exhibitor Product Guide
FEATURED EVENTS
IEC IEC
OFFICIAL HOST SPONSOR
Agilent Technologies
IP SUMMIT SPONSOR
ChipEstimate.com
CORPORATE PARTNER
Rambus
DIAMOND SPONSORS
LeCroy
LeCroy
GOLD SPONSORS
Mentor Graphics
SILVER SPONSORS
SILVER SPONSORS MoSys
CORPORATE REGISTRATION SPONSORS
Altera
Cisco
Ericsson
National Semiconductor
Sun Microsystems
Xilinx
DesignCon - Sponsors

In00foVault Sponsor SiSo

CHIPHEAD'S SOCIAL NETWORKS
DesignCon 2010