Masahiro Aoyagi, Research Group Leader,
Nanoelectronics Research Institute, National Institute of AIST

Optoelectronic packaging technologies, such as optical fiber wiring sheets with fine multimode fibers, compact EO/OE parallel link modules and small size backplane connectors have been developed which enables us to fabricate an optoelectronic hybrid backplane for 100G Ethernet switch/router. These technologies are suitable for the development of high performance back planes and could be used for various types of switch/routers. To demonstrate their usefulness, an optoelectronic hybrid backplane prototype has been made in which optical fiber wiring sheets with small size backplane connectors are attached to zone 3 of ATCA PICMG^TM 3.0 backplane.