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VERSION:2.0
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CLASS:PUBLIC
PRIORITY:3
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UID:101201044
SUMMARY:DesignCon 2010 - 5-TP2 | Introduction and Comparison of an Alternate Methodology for Measuring Loss Tangent of PCB Laminates 
LOCATION:Santa Clara Convention Center, Santa Clara, California 
DTSTART:20100202T205000Z
DTEND:20100202T213000Z
DTSTAMP:20100203T204034Z
DESCRIPTION:Recent advances in printed-circuit board density and increase of interconnect speed have raised the mainstream need for low-loss dielectric materials. Even though the choice of available laminates with medium and low loss is exploding, it comes with a confusing array of possible test methods for dielectric loss (Df) measurement. One of the primary challenges is that dielectric loss mostly matters at high frequencies where the dielectric loss cannot be measured independent of other contributors. We can measure various signatures of overall loss, which is the result of not only dielectric loss, but also copper resistivity, copper volume, copper surface roughness, radiation and potential non-homogeneities and non-isotropy of materials. There are three broad categories of measurement techniques: a) direct impedance measurements, b) resonance-based methods and c) wide-band model-based signature tests, several of them are now IPC standards. This paper introduces the model-based Capacitance Gradient Method (CGM), which is largely independent of conductive and radiation losses. The paper will also provide a comparative overview with a few selected methodologies, such as Split-Cylinder Resonance and Parallel-Plate methods, describing their strengths and potential pitfalls, together with real-life test data.
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