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A Systematic Approach to PCB Material Characterization Using Time Domain TRL Calibration
Tuesday, February 2 | 2:00 pm - 2:40 pm

Victor Khilkevich, Postdoctoral Fellow, EMC Laboratory,
Missouri University of Science and Technology
Vysakh Sivarajan, MS student,
Missouri University of Science and Technology
Dazhao Liu, Ph. D. student,
Missouri University of Science and Technology
Brice Achkir, Engineering Manager, Cisco Systems
Hongxia Ning, Cisco Systems
Marina Y. Koledintseva, Research Professor,
Missouri University of Science and Technology
James L. Drewniak, Curators' Professor,
Missouri University of Science and Technology

Application of the Thru-Reflect-Line (TRL) calibration to the time domain measurement of S-parameters (t-TRL) allows for significantly increasing an accuracy of the obtained results. However, the accuracy of the t-TRL is still less than that of the frequency domain vector network analyzers (VNA). There are two main sources of inaccuracies in the t-TRL calibration: random errors such as an additive noise and jitter, and systematic errors associated with cables, connectors, and port mismatches. The paper addresses these two types of errors by proper selection of the number of sampling points, waveform averages, and record time. The PCB dielectric parameters extraction tool based on TDR/TDT measurements together with the t-TRL calibration has been developed.

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