Zhe Li, Engineer, Package Technology, Altera Corp.
Hong Shi, Manager, Altera Corp.
Ken Kwan
John Xie
Hui Liu
Richard Chen
Hoon Ngik Low

This paper describes a systematic approach for FPGA die/package PDN model extraction and correlation. Full chip PDN model was developed for analyzing noise propagation through power grid and on-die noise decoupling with ODC placements. Distributed package model was attached for an integrated modeling to simulate PDN interaction between die and package. Time and frequency domain correlation of die and package PDN noise is performed by comparing measurements and simulations.