Souvik Mukherjee, Signal Integrity Engineer, Texas Instruments Inc.
Dr. Dipanjan Gope, Vice-President, R&D, Physware Inc.
Dr. Rajen Murugan, Signal Integrity Engineer, Texas Instruments Inc.
Dr. Vikram Jandhyala, CEO, Physware Inc.
Dr. Django Trombley, RF Characterization Engineer, Texas Instruments

This paper presents an accurate simulation, hardware development and measurement methodology to accurately characterize electrical performance metrics of packages and PCBs. This is addressed by developing a dedicated PCB and package test vehicle, measurement and simulation setup of impedance on power delivery nets and cross-coupling between a set of aggressor and victim signal nets. In order to address simulation accuracy with required efficiency, appropriate algorithms have been evaluated. Benchmarking of different modeling techniques have been performed against measurements in order to scope applicability of commercially available EM solvers.