Xiaoxiong (Kevin) Gu, Research Staff Member, IBM T. J. Watson Research Center
Renato Rimolo-Donadio, Ph.D. Student, Technische Universität Hamburg-Harburg
Zhenwei Yu, Ph.D Student, Missouri University of Science and Technology
Francesco de Paulis, Ph.D Student, University of L'Aquila
Young H. Kwark, , IBM
Matteo Cocchini, , IBM
Mark B. Ritter, IBM
Albert Ruehli, IBM
Bruce Archambeault, IBM
Jun Fan, MST
Christian Schuster, TUHH

Physics-based models for vias and traces are presented and applied to simulate multilayer interconnects at the package and printed circuit board levels. Different interconnect structures are studied with model-to-hardware correlation including via arrays and differential links between package via fields. These models also enable efficient power integrity analysis. Specifically, we used the models to analyze the impedance of power distribution network, the coupling of power noise to high-speed signal nets, as well as the effects of decoupling capacitor placement. An improvement on the simulation time at least three orders of magnitude has been observed with respect to full-wave simulations.