
3-TA1 Achieve Higher Performance and Lower Power Consumption for Mass Storage Designs with SATA Device IP
Mick Posner, Product Manager, DesignWare® IP Solutions, Synopsys
3-TA2 Configurable DAC for Mixed-Signal SoC Integration with Maximum Design Reusability
Lior Amarilio, Chief Architect, R&D, ChipX
13-TA3 De-Embed Probe with New Switched Load Tip Technology
John Pickerd, Principal Engineer, Tektronix
3-TA4 Toward Harnessing the True Potential of IP Reuse
Rajeev Ranjan, Chief Technology Officer, Jasper Design Automation
7-TA4 A Signal Integrity Comparison of 25 Gbps Backplane Systems Using Varying High-Density Connector Performance Levels
Chad Morgan, Principal Engineer, Circuits and Design, Tyco Electronics
11-TP2 Control of Electromagnetic Radiation from Integrated Circuit Heat Sinks
Syed Bokhari, Lead SI and EMC Specialist, Fidus Systems
13-TH2 Noise Injection for Design Analysis and Debugging
Douglas Smith, Engineering Consultant, D. C. Smith Consultants
Ethernet Alliance Exhibit Preview

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Brian Bailey Brian Bailey Consulting DesignCon consistently provides the information that engineers need to get their jobs done more efficiently and effectively. Couple this with the exhibition, where they can find the latest tools and technologies, and the engineers have everything they need to return true value to their companies. |

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Eric Bogatin Signal Integrity Evangelist Bogatin Enterprises "DesignCon is THE conference for signal integrity." "If you are going to one show this year, it should be DesignCon. There is no larger gathering of all the movers and shakers in the industry. If you’ve got a signal integrity problem, you can probably find the solution with either the vendors exhibiting or from the experts walking the halls of DesignCon." |

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David Brunker Technical Fellow, Commercial Products Division Molex "DesignCon has become a refined forum for emerging technology. DesignCon presents a great opportunity to be exposed to advanced electronics and communications hardware and to level set one’s designs and design process. "The Exhibition Hall provides hands-on contact with emerging data and communications components as well as the latest test equipment to support development. The conference papers provide the glue to hold it together. "DesignCon is a conference for builders and doers—for anyone who wants to make something happen." |

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Istvan Novak Signal-Integrity Senior Staff Engineer, Volume Server Products Sun Microsystems "Over time DesignCon has become the most important technical conference for me. The wealth of information we get with my coworkers from the exhibition floor and from the conference papers proved to be invaluable." |

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Mike Resso Product Manager, Signal Integrity Applications, Component Test Division Agilent Technologies "DesignCon has been the premier signal integrity event worldwide each year for Agilent Technologies. It has delivered consistently high-quality technical papers focused on the practical aspects of high-speed digital design. In addition, the exhibition floor has always been the place to watch for emerging technologies to materialize into live measurement demonstrations. "As a major exhibitor, we plan our annual new product releases to coincide with DesignCon to achieve maximum impact to our signal integrity audience. "As an attendee, I find the technical people conducting the booth demonstrations to be exceptionally well versed in their specific field of engineering and always willing to have an 'engineer-to-engineer' type discussion on the floor. This is very helpful when I'm trying to learn more about a particular area of interest." |

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Adam Traidman Group Marketing Director, Chip Planning Solutions Cadence Design Solutions "We view DesignCon as a highly tuned conduit to Silicon Valley design teams who are interested in taking advantage of new products and services to accelerate their business,” said Adam Traidman, former president and CEO of Chip Estimate Corporation. “In addition to launching ChipEstimate.com at the show several years past, the event has also played an important role in helping to fuel brand awareness and growth in our community of users." |

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Kathy Werner IP Strategy and Business Manager Freescale Semiconductor "DesignCon addresses the 'soup to nuts' of system design, not only including the engineering aspects of design and implementation, but business and third-party considerations. Once you hear the experiences and insights from your colleagues in the presentations and panel discussions, you can talk to the exhibitors that supply the tools and technologies that support making your vision a reality. It’s a one-stop shop for discussions on the thorny issues everyone faces in design and tools that facilitate implementation." |

Webcast
Formerly known as iForum
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Multicore and Virtualization Key Enablers for Next-Generation Network Architecture
Fawzi Behmann, Director, Strategic Marketing, Freescale |

![]() Dr. Rob Aitken |
![]() Sergio Camerlo |
![]() Charlie Cheng |
![]() Kevin Donnelly |
![]() Harry Foster |
![]() Mark Gogolewski |
![]() Shankar Hemmady |
![]() Dr. Mike Peng Li |
![]() Sury Maturi |
![]() Greg Peters |
![]() Rajeev Ranjan |
![]() Mobashar Yazdani |

Executive Perspectives
Captured at DAC 2009
![]() Steve Bannon |
![]() Eric Bogatin |
![]() Brani Buric |
![]() Ron Choi |
![]() Bill Finch |
![]() Tom Flynn |
![]() Mike Gianfagna |
![]() Joel Goergen |
![]() Rich Goldman |
![]() Jonathan Oakley |
![]() Bob Pokrzywa |
![]() Xerxes Wania |
![]() Todd Westerhoff |
![]() Kazu Yamada |

TecPreviews
Captured at DesignCon 2009
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IC Low Power Planning and Estimation Buda Leung, Sr. Technical Leader, Cadence Design Systems |
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Learn about the latest quality IP Sean O'Kane, Marketing Director, Chip Planning Solutions Organization, ChipEstimate.com |
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An IEC Publications Reading Intellectual Property for Electronic Systems: An Essential Introduction Kathy Werner, P Strategy and Business Manager, Freescale Semiconductor |
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An IEC Publications Reading Power Distribution Network Design Methodologies Barry Williams, Sun Microsystems Larry Smith, Altera Steve Weir, TeraSpeed Bruce Archambeault, IBM |
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Serial Data Network Analysis Dima Smolyansky, Sampling Scope Marketing, Tektronix |
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V-O Halogen-free Engineering Polymers for Greener Electronics Edson Ito, Vectra® LCP Technical Marketing Manager, Ticona |





















































