DesignCon 2009
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Podcasts

3-TA1 Achieve Higher Performance and Lower Power Consumption for Mass Storage Designs with SATA Device IP
Mick Posner, Product Manager, DesignWare® IP Solutions, Synopsys

3-TA2 Configurable DAC for Mixed-Signal SoC Integration with Maximum Design Reusability
Lior Amarilio, Chief Architect, R&D, ChipX

13-TA3 De-Embed Probe with New Switched Load Tip Technology
John Pickerd, Principal Engineer, Tektronix

3-TA4 Toward Harnessing the True Potential of IP Reuse
Rajeev Ranjan, Chief Technology Officer, Jasper Design Automation

7-TA4 A Signal Integrity Comparison of 25 Gbps Backplane Systems Using Varying High-Density Connector Performance Levels
Chad Morgan, Principal Engineer, Circuits and Design, Tyco Electronics

11-TP2 Control of Electromagnetic Radiation from Integrated Circuit Heat Sinks
Syed Bokhari, Lead SI and EMC Specialist, Fidus Systems

13-TH2 Noise Injection for Design Analysis and Debugging
Douglas Smith, Engineering Consultant, D. C. Smith Consultants

eSilicon Exhibit Preview

Ethernet Alliance Exhibit Preview

Gigatest Labs Exhibit Preview

Molex Exhibit Preview

SiSoft Exhibit Preview

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Testimonials

Brian Bailey
Brian Bailey
Brian Bailey Consulting

DesignCon consistently provides the information that engineers need to get their jobs done more efficiently and effectively. Couple this with the exhibition, where they can find the latest tools and technologies, and the engineers have everything they need to return true value to their companies.


Eric Bogatin
Eric Bogatin
Signal Integrity Evangelist
Bogatin Enterprises

"DesignCon is THE conference for signal integrity."

"If you are going to one show this year, it should be DesignCon. There is no larger gathering of all the movers and shakers in the industry. If you’ve got a signal integrity problem, you can probably find the solution with either the vendors exhibiting or from the experts walking the halls of DesignCon."


David Brunker
David Brunker
Technical Fellow, Commercial Products Division
Molex

"DesignCon has become a refined forum for emerging technology. DesignCon presents a great opportunity to be exposed to advanced electronics and communications hardware and to level set one’s designs and design process.

"The Exhibition Hall provides hands-on contact with emerging data and communications components as well as the latest test equipment to support development. The conference papers provide the glue to hold it together.

"DesignCon is a conference for builders and doers—for anyone who wants to make something happen."


Istvan Novak
Istvan Novak
Signal-Integrity Senior Staff Engineer, Volume Server Products
Sun Microsystems

"Over time DesignCon has become the most important technical conference for me. The wealth of information we get with my coworkers from the exhibition floor and from the conference papers proved to be invaluable."


Mike Resso
Mike Resso
Product Manager, Signal Integrity Applications, Component Test Division
Agilent Technologies

"DesignCon has been the premier signal integrity event worldwide each year for Agilent Technologies. It has delivered consistently high-quality technical papers focused on the practical aspects of high-speed digital design. In addition, the exhibition floor has always been the place to watch for emerging technologies to materialize into live measurement demonstrations.

"As a major exhibitor, we plan our annual new product releases to coincide with DesignCon to achieve maximum impact to our signal integrity audience.

"As an attendee, I find the technical people conducting the booth demonstrations to be exceptionally well versed in their specific field of engineering and always willing to have an 'engineer-to-engineer' type discussion on the floor. This is very helpful when I'm trying to learn more about a particular area of interest."


Adam Traidman
Adam Traidman
Group Marketing Director, Chip Planning Solutions
Cadence Design Solutions

"We view DesignCon as a highly tuned conduit to Silicon Valley design teams who are interested in taking advantage of new products and services to accelerate their business,” said Adam Traidman, former president and CEO of Chip Estimate Corporation. “In addition to launching ChipEstimate.com at the show several years past, the event has also played an important role in helping to fuel brand awareness and growth in our community of users."


Kathy Werner
Kathy Werner
IP Strategy and Business Manager
Freescale Semiconductor

"DesignCon addresses the 'soup to nuts' of system design, not only including the engineering aspects of design and implementation, but business and third-party considerations. Once you hear the experiences and insights from your colleagues in the presentations and panel discussions, you can talk to the exhibitors that supply the tools and technologies that support making your vision a reality. It’s a one-stop shop for discussions on the thorny issues everyone faces in design and tools that facilitate implementation."

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Webcast
Formerly known as iForum
Webcast Image

Multicore and Virtualization Key Enablers for Next-Generation Network Architecture

Fawzi Behmann, Director, Strategic Marketing, Freescale
Jeff Timbs, Director of Marketing, Freescale Semiconductor
Nina Wilner, Software Architect, IBM
Johan Fornaeus, Director Engineering Systems, Wind River
Ross Dickson, Principal Technology Specialist, Virtutech Inc.

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On the Road to DesignCon 2009
Dr. Rob Aitken

Dr. Rob Aitken
R&D Fellow
ARM

Sergio Camerlo

Sergio Camerlo
Director of Enginering
Redback Networks-An Ericsson Company

Charlie Cheng

Charlie Cheng
CEO
Kilopass

Kevin Donnelly

Kevin Donnelly
Vice President, Engineering
Rambus

Harry Foster

Harry Foster
Chief Verification Scientist
Mentor Graphics

Mark Gogolewski

Mark Gogolewski
CTO
Denali Software

Shankar Hemmady

Shankar Hemmady
Principal Engineer
Synopsys

Dr. Mike Peng Li

Dr. Mike Peng Li
Principal Architect
Altera

Sury Maturi

Sury Maturi
Director
National Semiconductor

Greg Peters

Greg Peters
Vice President and General Manager
Agilent

Rajeev Ranjan

Rajeev Ranjan
CTO
Jasper Design Automation

Mobashar Yazdani

Mobashar Yazdani
ASIC Program Manager
HP

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Executive Perspectives
Captured at DAC 2009

Steve Bannon

Steve Bannon
Area Vice President
LeCroy

Eric Bogatin

Eric Bogatin
President
Bogatin Enterprises

Brani Buric

Brani Buric
Executive Vice President of
Marketing and Sales
Virage Logic

Ron Choi

Ron Choi
Product Marketing Director
EVE

Bill Finch

Bill Finch
Senior Vice President
CAST, Inc.

Tom Flynn

Tom Flynn
Vice President
Ansoft

Mike Gianfagna

Mike Gianfagna
Vice President Marketing
Atrenta

Joel Goergen

Joel Goergen
Vice President of Technology and Chief Scientist
Force10 Networks, Inc.

Rich Goldman

Rich Goldman
Vice President Corporate
Marketing and Strategic Market Development
Synopsys

Jonathan Oakley

Jonathan Oakley
Vice President Sales and Marketing
CST of America

Bob Pokrzywa

Bob Pokrzywa
Vice President Strategy Development
FCI

Xerxes Wania

Xerxes Wania
President and CEO
Sidense

Todd Westerhoff

Todd Westerhoff
Vice President Software Products
SiSoft

Kazu Yamada

Kazu Yamada
Vice President and General Manager, Custom SoC Solutions Unit
NEC Electronics

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TecPreviews
Captured at DesignCon 2009

Cadence IC Low Power Planning and Estimation
Buda Leung, Sr. Technical Leader, Cadence Design Systems
ChipEstimate.com Learn about the latest quality IP
Sean O'Kane, Marketing Director, Chip Planning Solutions Organization, ChipEstimate.com
IEC Publications An IEC Publications Reading
Intellectual Property for Electronic Systems: An Essential Introduction

Kathy Werner, P Strategy and Business Manager, Freescale Semiconductor
IEC Publications An IEC Publications Reading
Power Distribution Network Design Methodologies

Barry Williams, Sun Microsystems
Larry Smith, Altera
Steve Weir, TeraSpeed
Bruce Archambeault, IBM
Ticona Serial Data Network Analysis
Dima Smolyansky, Sampling Scope Marketing, Tektronix
Ticona V-O Halogen-free Engineering Polymers for Greener Electronics
Edson Ito, Vectra® LCP Technical Marketing Manager, Ticona

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Winner DesignCon 2009 Video Contest
Advertisement
Rambus

Sponsors


Presented by
IEC

Official Sponsor

IP Summit Sponsor

Corporate Partner

Diamond Sponsors

Le CroyTektronix

Platinum Sponsors

Gold Sponsor

IP Ecosystem Sponsor

Corporate Registration Sponsors

Bayside DesignCisco
National SemiConductorRedback
Sun MicrosystemsXilinx


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