Modular I/O interconnects, such as SFP, XFP, SFP+ and others offer a high degree of flexibility for network builders. Flexibility between fiber and copper interconnects depends on the specific distance and speed needs of each individual link. Therefore, these products allow users to tailor the interconnect elements to the specific needs of the architecture, optimizing performance and cost. For next generation applications, such as Fibre Channel, Molex’s new ZXP technology will support the developing 16 Gbps Fibre Channel products. Moreover, ZXP is expected to support high-speed four lane interconnects, including emerging protocols such as 100 Gbps Ethernet.

The Impact™ backplane connector system, developed by Molex Incorporated, is the fastest, densest backplane connector on the market. Functioning at data rates over 20 Gbps and offering superior signal density up to 80 differential pairs per inch, Molex’s Impact System provides significant channel performance headroom for future system upgrades in both traditional backplane and midplane architectures.Impact’s broad-edge coupled, hybrid shielding technology enables low cross-talk and insertion loss. Impact is available today in 2-, 3-, 4-, 5- and 6-pair conventional backplane versions, 3- and 4- pair coplanar versions, a 5- pair mezzanine stacker version , a 4- pair cable version and 85 ohm versions with a complete range of guidance and power-solution options.For more information, visit: www.molex.com/link/Impact.html

Molex Incorporated’s Solder Charge Technology is a new SMT (surface mount technology) attach method for printed circuit board (PCB) adhesion. Stamping a solder charge is more precise than melting a solder ball onto a metal lead and reduces applied costs. Ideal for high-speed circuitry, solder charge permits the transmission line to reach the PCB, minimally disrupting the design and maintaining the system’s electrical properties. Up to three times stronger than typical Ball Grid Array (BGA) mounting methods, Solder Charge’s sloping solder filet is ideal for the assembly of high-end telecom equipment because of its sheer strength and pull-force. It offers superior compliancy, less stress on solder joints, lower applied costs, higher yields, and excellent fatigue strength. For more information, visit: www.molex.com/product/soldercharge.html.