The International Engineering Consortium is pleased to provide you with the following DesignCon logos. These logos are available to assist companies in highlighting their involvement in DesignCon and are to be used only in conjunction with marketing materials and communications promoting your involvement in the event.

All logos should always have at least 0.75" of clear space around them to separate them from surrounding elements. All logos may be reproduced only as submitted and may not be altered in any way.

	Chip Head Logo EPS (High Resolution) Format JPG Format
	DesignCon Logo EPS (High Resolution) Format JPG Format
	DesignCon 2009 Logo EPS (High Resolution) Format JPG Format
	DesignCon Logo with Chip Head EPS (High Resolution) Format JPG Format
	DesignCon Exhibitor Logo 234 x 60 GIF Format 130 x 60 GIF Format
	DesignTOUR Logo EPS (High Resolution) Format JPG Format
	IEC Logo JPEG Format GIF Format

180x150 pixel Event Banner Ad	120x90 pixel Event Banner Ad
468x60 pixel Event Banner Ad
728x90 pixel Event Banner Ad (not shown to scale)

Designed specifically for exhibitors at DesignCon 2008

190x160 pixel Exhibitor Banner Ad	120x90 pixel Exhibitor Banner Ad
468x60 pixel Exhibitor Banner Ad

Designed to be used in conjunction with the customized, VIP exhibition pass provided to each exhibiting company.

180x150 pixel Exhibits Pass Banner Ad	120x90 pixel Exhibits Pass Banner Ad
468x60 pixel Exhibits Pass Banner Ad