DesignCon 2009
Home Attendees Exhibitors Authors Press DesignVision Awards Hotel and Travel
Register Today
Technical Program Committee
The Technical Program Committee is responsible for solicitation and selection of conference papers, plenary panels, and session chairs. As the organizers and reviewers of the technical content, the Technical Program Committee has primary responsibility for the equality of the DesignCon technical program. Candidates for the Technical Program Committee are proven technical contributors in the fields covered by DesignCon. Active participation by committee members ensures a high-quality, well-targeted, and timely program.

DesignCon 2009 Conference Chair
James Lin, Vice President, Technology Infrastructure, National Semiconductor

Rami Ahola, Pricipal Technical Manager, Mentor Graphics
Robert Aitken, Fellow, ARM
John Andresakis, Vice President, Strategic Tech., Oak-Mitsui Technologies
Michael Annand, Interconnect Technologist, W.L. Gore & Associates
Tatsuya Arai, General Manager, High-Speed Interconnects, Hirose Electric
Bruce Archambeault, Distinguished Engineer, IBM
Brian Bailey, Principal, Brian Bailey Consulting
Ramesh Banda, Distinguished Member of Technical Staff, LSI Logic
Heidi Barnes, Senior Test Consultant, Verigy
Dana Bergey, Signal Integrity Manager, FCI
J.Bhasker, Architect, eSilicon Corporation
Ajay Bhatia, Sun Microsystems
Tim Blackmore, Senior Staff Engineer, Infineon Technologies
Luis Boluna, Technical Leader, Cisco Systems
Brad Booth, Senior Principal Engineer, AMCC
Ken Braund, Sales & Marketing Manager, Meritec
Brad Brim, Product Marketing Manager, Sigrity
David Brunker, Technical Fellow, Molex
Andrew Byers, Senior Application Engineer, Ansoft
Sergio Camerlo, Director, Engineering, Redback Networks
Robert Carter, Sr. Business Development Manager, Oak-Mitsui Technologies
Moises Cases, Distinguished Engineer, IBM
Federico Centola, EMC Technologist, Apple
Nitin Chawla, Member of Technical Staff, STMicroelectronics
Jinhua Chen, Consulting Design Engineer, EMC Corporation
Raymond Y. Chen, Senior Vice President, Engineering, Sigrity
Xiaohe Chen, Signal Integrity Engineer, Apple
Wheling Cheng, Technical Leader, Cisco Systems
Sam Chitwood, Field Application Engineer Manager, Sigrity
Chang Choo, Professor, San Jose State University
Antonio Ciccomancini Scogna, Senior Application Engineer, CST of America
Tom Cohen, Principal Development Engineer, Amphenol-TCS
John D'Ambrosia, Ethernet Ecosystem Architect, Force10 Networks
Jim DeLap, Application Engineer, Ansoft Corporation
Olivier Despaux, Staff Strategic Applications Engineer, Xilinx
Joseph Diepenbrock, Senior Technical Staff Member, IBM
James Drewniak, Professor, Missouri University of Science and Technology
David Dunham, Electrical Engineering Manager, Molex
Mazlina Esa, Professor, Universiti Teknologi Malaysia
Jun Fan, Assistant Professor, Missouri University of Science & Technology
Saverio Fazzari, Associate, Booz Allen Hamilton
Tom Flaherty, Project Engineer, Corning Gilbert
Harry Foster, Principal Engineer, Mentor Graphics
Michael Fowler, Principal Strategic Mktg. Engineer, Fairchild Semiconductor
Paul Franzon, Professor, North Carolina State University
John Grebenkemper, Consultant, TALI Consulting
Brett Grossman, Technologist & Senior Staff Engineer, Intel
Robert Haller, Hardware Architect, Enterasys
Gert Havermann, Signal Integrity Engineer, HARTING Electronics
Amir Hekmatpour, Senior Engineer, IBM
Richard Ho, D. E. Shaw Research LLC
Sachin Idgunji, Principal Engineer, ARM
Alfonso Iniguez, Lead Verification Engineer, Freescale Semiconductor
Vikram Jandhyala, Associate Professor, University of Washington
Karl Kachigan, Signal Integrity Program Manager, Agilent Technologies
Isaac Kantorovich, Senior Hardware Engineer, Intel
Bhanu Kapoor, Consultant/Owner, Mimasic
Sunil Khatri, Assistant Professor, Texas A&M University
Andrew Kim, Senior Systems Architect, Quellan
Vikas Kohli, Architect, Front-End Tools, Cadence Design Systems
Ravi Kollipara, Senior Principal Engineer, Rambus
C. Kumar, Senior Software Architect, Sigrity
Brock LaMeres, Assistant Professor, Montana State University
Mike Peng Li, Principal Architect, Altera
Feng Ling, Vice President, Engineering, Physware
Geping Liu, Member of Technical Staff, Altera
Christopher Loberg, Senior Marketing Manager, Tektronix
Vasanta Madduri, Technical Marketing Manager, National Semiconductor
Om Mandhana, Senior R&D Engineer, Freescale Semiconductor
Henri Maramis, Technology Archtecture Manager, Intel
Mark Marlett, Principal Design Engineer, LSI Logic
Daniel Martin, Senior Application Engineer, Catalytic
Andrew Martwick, Electromagnetics Engineer, Intel
Sury Maturi, Director, Design Automation, National Semiconductor
Steven McKinney, Technical Marketing Engineer, Mentor Graphics
Herve Menager, SoC Architect, NXP Semiconductors
Jason Miller, Staff Engineer, Sun MicroSystems
Ozgur Misman, Substrate Co-Design Manager, Amkor Technology
Jitendra Mohan, Engineering Manager, National Semiconductor
Bhyrav Mutnury, High-Speed Electrical Design Engineer, IBM
James Nadolny, Senior SI & EMI Engineer, Samtec
Alfred Neves, Senior Staff Engineer, Teraspeed Consulting
Istvan Novak, Senior Signal Integrity Staff Engineer, Sun Microsystems
John Plasterer, Manager, Mixed Signal Development, PMC-Sierra
Satish Premanathan, Principal Technical Consultant, Wipro
Peter Pupalaikis, Principal Technologist, LeCroy Corporation
David Quint, Master Engineer, Hewlett-Packard
Shafiq Rahman, Technical Staff Member, Hewlett-Packard
Suresh Rajgopal, Senior Principal Engineer, STMicroelectronics
Michael Resso, Business Development Manager, Agilent Technologies
Woong Hwan Ryu, Senior Staff Analog Engineer, Intel
Anthony Sanders, Principal Engineer, Infineon Technologies
John Sawdy, Signal Integrity Engineer, Meritec
Christian Schuster, Professor, Technical University Hamburg-Harburg
Hong Shi, Manager, Packaging Design Engineering, Altera
Kaijian Shi, Principal Consultant, Synopsys
Leena Singh, Verification Architect, Rambus
Dima Smolyansky, Director, Tektronix
Philippe Sochoux, H/W Engineer Manager, Cisco Systems
Michael Steinberger, Distinguished Member of Technical Staff, SiSoft
Ransom Stephens, Writer, Physicist, Public Speaker, Ransom's Notes
Suresh Subramaniam, Senior Staff Engineer, Tabula
David Tamura, Sr. Manager, Design Technology, National Semiconductor
Lars Thon, Independent Consultant, Aeluros
Peter Tomaszewski, Scientist, SI & Packaging, Force 10 Networks
Ken Umino, Staff Consultant, Synopsys
Ambrish Varma, Senior Member of Technical Staff, Cadence Design Systems
Tanit Virutchapunt, Power Integrity Specialist, Sigrity
Michael Vrazel, Technical Director, Quellan
Colin Warwick, Signal Integrity Product Manager, Agilent Technologies
Kathy Werner, IP Strategy and Business Manager, Freescale Semiconductor
Todd Westerhoff, Vice President, Software Products, SiSoft
David Whipp, Senior Verification Engineer, NVIDIA
Jim Wieser, Chief Technologist, National Semiconductor
Larry Williams, Director of Business Development, Ansoft
Markus Witte, Signal Integrity Manager, HARTING Electronics
Mike Wondolowski, Principal Engineer, Zebra Technologies
Xiaodong (Luke) Wu, Engineer, Texas Instruments
Zhiping Yang, Technical Leader, Cisco Systems
Mobashar Yazdani, ASIC Program Manager, Hewlett-Packard
Ping Yeung, Product Manager, Mentor Graphics
Arch Zaliznyak, Supervising Senior MTS, Altera
Iliya Zamek, Member Technical Staff, Altera
Fabrizio Zanella, Support Manager, CST of America
Jared Zerbe, Director of Engineering, Rambus
Jianmin Zhang, Senior Signal Integrity Engineer, Cisco Systems
Jin Zhao, Application Engineer, Sigrity
Winner DesignCon 2009 Video Contest
Advertisement
Rambus

Sponsors


Presented by
IEC

Official Sponsor

IP Summit Sponsor

Corporate Partner

Diamond Sponsors

Le CroyTektronix

Platinum Sponsors

Gold Sponsor

IP Ecosystem Sponsor

Corporate Registration Sponsors

Bayside DesignCisco
National SemiConductorRedback
Sun MicrosystemsXilinx


Chiphead's Social Networks


Join our group on

LinkedIn


Become a fan of Chiphead on Facebook

Chiphead

Infovision


Quick Links