The fabless industry’s migration to more advanced nodes, lower-power and multi-processor devices, and multi-chip packaging continually raises new challenges that require new approaches to chip design. Emerging strategies include improved design-automation tools, closer links between design and manufacturing, outsourced design services, and collaborative design alliances.

This panel explores what’s working for some of the key players in the design and manufacturing communities and the major challenges to implementing these strategies. In addition, panelists will be encouraged to discuss the actual costs and how to measure return on investment.

Issues/strategies to be covered include the following:

• Developing more robust design and verification tools
• Addressing the productivity gap with system-level design
• The role of OPC and other resolution-enhancement technologies
• How foundries can participate in the design process
• Who will pay for the additional collaboration activities

Dylan McGrath Senior Editor EE Times

Mr. McGrath is a senior editor with EE Times. He has worked as a technology journalist and marketing writer for the past 12 years, mainly within the semiconductor industry with a focus on capital equipment, manufacturing, and electronic design automation.

Luis Ancajas Vice President Faraday Technology

Mr. Ancajas has been with Faraday since 2003, responsible for North America Sales. He has helped to establish Faraday's presence in key high volume SOC markets for video, wireless networks and storage. He has more than 20 years of R&D, sales and management experience in the semiconductor and computer industries.

Nitin Deo Group Marketing Director Cadence Design Systems

Mr. Deo has enjoyed a broad range of industry experience including design, product marketing, sales and business development. Before joining Cadence, Mr. Deo was vice president of marketing and business development at Clear Shape Technologies, which was acquired by Cadence in 2007.

Dr. Franklin Kalk Executive Vice President and Chief Technology Officer Toppan Photomasks, Inc.

Dr. Kalk is Toppan Photomasks’ chief technology officer and leads Toppan Photomasks’ global research-and-development programs, supporting customers’ technology roadmaps. He was named to the position in April 2004 at DuPont Photomasks and he retained his title after the acquisition by Toppan Printing Company.

Dinesh Ramanathan Executive Vice President, Data Communications Division Cypress Semiconductor

Mr. Ramanathan is executive vice president of the Data Communications Division at Cypress Semiconductor Corporation. The division designs and develops products such as dual port interconnects, FIFOs, and PHYs, and also designs TCAMs used in switches and routers to build out the Internet infrastructure.

Edward Wan Senior Director of Design Technology Support and Marketing TSMC North America

Mr. Wan is currently the senior director of design technology support and marketing of TSMC North America. Before joining TSMC, he was CEO of Spike Technologies, vice president of worldwide field engineering at United Microelectronics Corporation, vice president at Cadence, and vice president of engineering at LSI Logic.