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3-TA2
Configurable DAC for Mixed-Signal SoC Integration with Maximum Design Reusability
Tuesday, February 3 | 9:20 am – 10:00 am

Lior Amarilio, Chief Architect, R&D, ChipX
Ran Rosenzweig, Mixed-Signal Group Manager, ChipX

Today’s SoC no longer settles solely for digital design integration. Rather, integration of analog and mixed-signal blocks such as high-speed interfaces and data converters is becoming common. When an analog block design takes future integration requirements, future scalability, and high configurability into account, reusing this IP becomes almost risk-free. One of the central analog components in many SoCs is a DAC. This article addresses the fundamentals of current steering DAC designs and describes implementations and tradeoffs that help to assure smooth SoC integration. The paper investigates the methods and potential approaches to make a DAC highly configurable and scalable while also considering design for test. The paper provides application examples.

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