Mr. Cases has 38 years of progressive experience in VLSI chip and package designs, in system-level electrical and package designs, and in complex project and people management. At IBM, he is responsible for system electrical design and integration of modular and blade servers, signal and power distribution integrity, and system-level timings of complex multiple board system designs. He obtained an M.S.C.E. from Syracuse University in New York in 1979, an M.S.E.E. from New York University in 1973, and a B.S.E.E. from City College of New York in 1969. He is a senior member of IEEE.

Dr. Mandhana is a Senior R&D Engineer in the Networking and Multimedia Group (NMG) of Freescale Semiconductor, Austin, Texas, since 1998. His current responsibilities include lead and develop methodology and tools strategy for chip, package, board, and interconnect co-design modeling and simulations capability to address power integrity and signal integrity issues related to NMG products.

Dr. Ali is a Principal Scientist at Broadcom Corporation, where he works as a Signal Integrity Engineer responsible for various on-chip, off-chip and package SI issues. He has over 20 years of professional experience in various industries.

Dr. Keshavan joined Sigrity in February 2008 and has more than 24 years of experience in the EDA industry. He has worked at Telesis, then Valid, and finally Cadence from 1984–1998. At Cadence, Dr. Keshavan was the architect for specctraquest tool. He wrote the time domain simulator tlsim, which lies at the core of specctraquest. Earlier, Dr. Keshavan was responsible for analyzing heat transfer in printed circuit boards. He rejoined Cadence from 2003 to 2008 and developed the company’s Channel Analysis tool.

Mr. Smolyansky spent his professional career in the instrumentation and measurement industry, working with high-speed time domain reflectometry oscilloscopes and frequency domain network analyzers. He is currently responsible for TDR and S-parameter serial data measurement solutions at Tektronix. During his professional career, Mr. Smolyansky has accumulated significant experience in the area of high-frequency measurements and gigabit interconnect measurements and modeling. He has published a number of papers and taught short courses on interconnect measurements and modeling.

Dr. Williams is responsible for building strategic relationships with leading Ansoft customers and business partners. His responsibilities include the strategic direction of Ansoft’s products for microwave, wireless, and high-speed electronic component design. Dr. Williams is an expert in the application of electromagnetic field simulation to the design of antennas, microwave components, and high-speed electronics. He has more than 19 years of experience in the fields of electromagnetics and communications engineering and has published numerous technical papers on the subject.