DesignCon 2009
Home Attendees Exhibitors Authors Press DesignVision Awards Hotel and Travel
Register Today
Schedule
12-WA1
Measurement-Assisted Electromagnetic Extraction of Interconnect Parameters on Low-Cost FR–4 boards for 6–20 Gbps Applications
Wednesday, February 4 | 8:30 am – 9:10 am

Yuriy Shlepnev, President, Simberian
Alfred Neves, Senior Staff Signal Integrity Engineer, Teraspeed Consulting Group
Tom Dagostino, Vice President Engineering, Teraspeed Labs
Scott McMorrow, President, Teraspeed Consulting

The presentation unites interconnect analysis and measure-based verification implementing advanced TRL/LRM calibration along with conditioning of the de-embedded S-parameters. We show practical test cases on a FR4 board to 1 percent correspondence between full-wave modeling and measurements. A test board with 30 test structures has been fabricated and investigated experimentally and numerically over the frequency band from 300 KHz to 20 GHz. To identify properties of the materials, transmission line segments and resonant structures are used. Broadband dielectric models are extracted by comparison of experimental data with results of 3D full wave.
Winner DesignCon 2009 Video Contest
Advertisement
Rambus

Sponsors


Presented by
IEC

Official Sponsor

IP Summit Sponsor

Corporate Partner

Diamond Sponsors

Le CroyTektronix

Platinum Sponsors

Gold Sponsor

IP Ecosystem Sponsor

Corporate Registration Sponsors

Bayside DesignCisco
National SemiConductorRedback
Sun MicrosystemsXilinx


Chiphead's Social Networks


Join our group on

LinkedIn


Become a fan of Chiphead on Facebook

Chiphead

Infovision


Quick Links