Schedule
12-WA1
Measurement-Assisted Electromagnetic Extraction of Interconnect Parameters on Low-Cost FR–4 boards for 6–20 Gbps Applications
Wednesday, February 4 | 8:30 am – 9:10 am
Yuriy Shlepnev, President, Simberian
Alfred Neves, Senior Staff Signal Integrity Engineer, Teraspeed Consulting Group
Tom Dagostino, Vice President Engineering, Teraspeed Labs
Scott McMorrow, President, Teraspeed Consulting
The presentation unites interconnect analysis and measure-based verification implementing advanced TRL/LRM calibration along with conditioning of the de-embedded S-parameters. We show practical test cases on a FR4 board to 1 percent correspondence between full-wave modeling and measurements. A test board with 30 test structures has been fabricated and investigated experimentally and numerically over the frequency band from 300 KHz to 20 GHz. To identify properties of the materials, transmission line segments and resonant structures are used. Broadband dielectric models are extracted by comparison of experimental data with results of 3D full wave.