Anthony Sanders, Senior Principal, COM, Infineon Technologies
Thomas Eichler, Principal Engineer, Infineon Technologies
Bernd Pilgram, Senior Engineer, Infineon Technologies
Dietmar Wenzel, Principal Engineer, Infineon Technologies
High-speed interfaces are a common technology in all electronic segments. Recently this proliferation has extended to RF applications, where the need for low-cost, high-bandwidth, chip-to-chip communication is apparent. In such a sensitive application, significant care must be taken to ensure that the electromagnetic emissions of the data signal do not cause the RF sensitivity to be compromised.

This paper will explore recent developments in this area and present advancements in methodologies capable of solving such complex compromises. Measurement results from recent silicon vehicles in 65 nm are used to show correlation and feasibility.